Heater apparatus-integrated top cover for a computing device

Patent metadata

Field	Value
Publication number	US-11937396-B2
Application number	US-202217576713-A
Country	US
Kind code	B2
Filing date	Jan 14, 2022
Priority date	Jan 14, 2022
Publication date	Mar 19, 2024
Grant date	Mar 19, 2024

Abstract

A computing device includes a top cover, a heater apparatus, a plurality of temperature sensors, and a heating control component. The heater apparatus includes a heater component and a connector, and the heater component is affixed to the top cover. The plurality of temperature sensors are operatively connected to the heating control component. The heating control component configured to manage the heater apparatus using the plurality of temperature sensors.

First claim

What is claimed is:

1. A computing device, comprising:
a top cover;
a heater apparatus, wherein the heater apparatus comprises a heater component and a connector, wherein the heater component is affixed to the top cover,
wherein the connector comprises a top portion and a bottom portion,
wherein the top portion is operatively connected to the heater component and the bottom portion is operatively connected to a printed circuit board to activate the heater component;

a plurality of temperature sensors,
wherein a first end of a first temperature sensor of the plurality of temperature sensors is operatively connected to a heating control component and a second end of the first temperature sensor is operatively connected to the heater component,
wherein a first end of a second temperature sensor of the plurality of temperature sensors is operatively connected to the heating control component and a second end of the second temperature sensor is operatively connected to an environmental control component; and

the heating control component configured to manage the heater apparatus using the plurality of temperature sensors and to obtain information with respect to a temperature of a processor via a third temperature sensor of the plurality of temperature sensors to prevent overheating of the processor.

2. The computing device of claim 1 , further comprising:
the printed circuit board, wherein a first end of the connector is affixed to the heater component and a second end of the connector is affixed to the printed circuit board.

3. The computing device of claim 2 , wherein the heating control component is affixed to the printed circuit board.

4. The computing device of claim 1 , wherein the heater component is configured to heat at least one hardware component in the computing device.

5. The computing device of claim 4 , wherein the at least one hardware component is mounted on the printed circuit board.

6. The computing device of claim 1 , wherein the heater apparatus further comprises:
a second heater component; and
a second connector, wherein a first end of the second connector is affixed to the second heater component and a second end of the second connector is affixed to the printed circuit board.

7. The computing device of claim 6 , wherein the heater component and the second heater component operate independently.

8. The computing device of claim 6 , wherein the second heater component is affixed to the top cover.

9. The computing device of claim 1 , wherein the heater component is a silicon rubber heater.

10. The computing device of claim 1 , wherein an area of the heater component is less than an area of the top cover.

11. The computing device of claim 1 , wherein the connector is a sliding power connector or a blind-mate power connector.

12. An information handling system, comprising:
a cabinet housing a plurality of computing devices;
the plurality of computing devices, wherein each of the computing devices comprises:
a top cover;
a heater apparatus, wherein the heater apparatus comprises a heater component and a connector, wherein the heater component is affixed to the top cover, wherein the connector comprises a top portion and a bottom portion,
wherein the top portion is operatively connected to the heater component and the bottom portion is operatively connected to a printed circuit board to activate the heater component;

a plurality of temperature sensors,
wherein a first end of a first temperature sensor of the plurality of temperature sensors is operatively connected to a heating control component and a second end of the first temperature sensor is operatively connected to the heater component,
wherein a first end of a second temperature sensor of the plurality of temperature sensors is operatively connected to the heating control component and a second end of the second temperature sensor is operatively connected to an environmental control component; and

the heating control component configured to manage the heater apparatus using the plurality of temperature sensors and to obtain information with respect to a temperature of a processor via a third temperature sensor of the plurality of temperature sensors to prevent overheating of the processor.

13. The information handling system of claim 12 , wherein each of the computing devices further comprises:
the printed circuit board, wherein a first end of the connector is affixed to the heater component and a second end of the connector is affixed to the printed circuit board.

14. The information handling system of claim 13 , wherein the heating control component is affixed to the printed circuit board.

15. The information handling system of claim 12 , wherein the heater component is configured to heat at least one hardware component in the corresponding computing device.

16. The information handling system of claim 15 , wherein the at least one hardware component is mounted on the printed circuit board in the corresponding computing device.

17. The information handling system of claim 12 , wherein the heater apparatus further comprises:
a second heater component; and
a second connector, wherein first end of the second connector is affixed to the second heater component and second end of the second connector is affixed to the printed circuit board.

18. The information handling system of claim 17 , wherein the heater component and the second heater component operate independently.

Assignees

• Dell Products Lp

Inventors

• Tunks Eric Michael
• Nikazm Ayedin
• Vivio Joseph Andrew

Classifications

• H05K5/0213

  Venting apertures; Constructional details thereof · CPC title

• H05K7/20 Primary

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• H05K5/03

  Covers · CPC title

• H05K7/20709 Primary

  for server racks or cabinets; for data centers, e.g. 19-inch computer racks · CPC title