Chip heater and heating aid arrangement

Patent metadata

Field	Value
Publication number	US-9900975-B2
Application number	US-201615081522-A
Country	US
Kind code	B2
Filing date	Mar 25, 2016
Priority date	Mar 25, 2016
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A chip heater and heating air arrangement includes a circuit module including a circuit board, chip unit mounted on the circuit board and locating member mounted around the chip unit, heating aid including flat heat-transfer base panel, locating structure mounted in the flat heat-transfer base panel and attached to the chip unit and mounting structure outwardly extended from the flat heat-transfer base panel and fastened to the locating member, heater fastened to the locating structure of the heating aid, and heat dissipating mechanism including a heat-transfer holder plate attached to the heater. If the temperature of the chip unit goes below 0° C., the heater is turned on to generate heat and enabling generated heat to be transferred through the heating aid to heat the chip unit to the normal operating temperature level, enabling the computer device that uses the chip heater and heating air arrangement to work under cold environment.

First claim

What the invention claims is:

1. A chip heater and heating aid arrangement, comprising
a circuit module comprising a circuit board, at least one chip unit mounted at said circuit board, and a locating member mounted at said circuit board around said at least one chip unit;
at least one heating aid mounted at said circuit module, each said heating aid comprising a flat heat-transfer base panel, a locating structure mounted in said flat heat-transfer base panel and kept in positive contact with one respective said chip unit, and a mounting structure outwardly extended from corners of said flat heat-transfer base panel and fastened to said locating member of said circuit module;
a heater fastened to said locating structure of one respective said heating aid opposite to one respective said chip unit; and
a heat dissipating mechanism comprising at least one heat-transfer holder plate mounted at a top side of one respective said heater,
wherein said locating structure of each said heating aid comprises a planar raised surface portion located at a top side thereof; each said heater defines therein a through hole for accommodating the said planar raised surface portion of the said locating structure of one respective said heating aid.

2. The chip heater and heating aid arrangement as claimed in claim 1 , wherein each said chip unit of said circuit module comprises a chip carrier, and a chip bonded to said chip carrier and electrically coupled to with said chip carrier; said locating structure of each said heating aid comprises a contact surface located at a bottom side thereof and kept in positive contact with the said chip of one respective said chip unit of said circuit module.

3. The chip heater and heating aid arrangement as claimed in claim 1 , wherein said locating member of said circuit module comprises a plurality of mounting holes; said mounting structure of each said heating aid comprises a plurality of zigzag mounting lugs and a mounting through hole located at a distal end of each said zigzag mounting lug and fastened to one respective said mounting hole of said locating member of said circuit module.

4. The chip heater and heating aid arrangement as claimed in claim 3 , wherein said mounting structure of each said heating aid further comprises a headed fastening component mounted in the said mounting through hole at each said zigzag mounting lug and fastened to one respective said mounting hole of said locating member of said circuit module, and a spring member mounted on each said headed fastening component and stopped between the head of the respective said headed fastening component and the respective said zigzag mounting lug.

5. The chip heater and heating aid arrangement as claimed in claim 1 , wherein said heat dissipating mechanism further comprises a planar heat transfer block bonded to a bottom side of each said heat-transfer holder plate and abutted against said planar raised surface portion of the said locating structure of one respective said heating aid.

6. The chip heater and heating aid arrangement as claimed in claim 5 , wherein said heat dissipating mechanism further comprises a planar bearing surface located at the bottom side of each said heat-transfer holder plate around the associating said planar heat transfer block and abutted against each said heater, at least one locating groove located at an opposing top side of each said heat-transfer holder plate, and a heat-transfer wire rod bonded to each said locating groove.

7. The chip heater and heating aid arrangement as claimed in claim 1 , wherein said locating structure of each said heating aid further comprises two protruding blocks located at the top side and aligned in a line, an insertion gap defined between said two protruding blocks; each said heater comprises a plurality of power lead wires located at one lateral side thereof and positioned in said insertion gap of said locating structure of the respective said heating aid.

8. The chip heater and heating aid arrangement as claimed in claim 7 , wherein said locating structure of each said heating aid further comprises a stop block located at the top side thereof opposite to said protruding blocks.

Assignees

• Adlink Tech Inc

Inventors

• Chen Jen Shi
• Fang Chih Liang

Classifications

• H10W40/10

  Arrangements for heating · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• G06F1/206

  comprising thermal management · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K1/0212 Primary

  Printed circuits or mounted components having integral heating means · CPC title