Temperature control device and method and electronic device

Patent metadata

Field	Value
Publication number	US-9756758-B2
Application number	US-201214384767-A
Country	US
Kind code	B2
Filing date	Apr 17, 2012
Priority date	Mar 14, 2012
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

Provided are a device and method and an electronic device for temperature control, which are used to solve the problem that electronic devices and components cannot operate in a low-temperature state. The temperature control device includes a temperature detection unit ( 10 ) configured to detect the operating temperature of a component ( 16 ); a heating unit ( 12 ) configured to heat the component ( 16 ) according to the detection result of the temperature detection unit ( 10 ) so that the operating temperature is between a first temperature and a second temperature; and a power supply interface ( 14 ) respectively connected to the temperature detection unit ( 10 ) and the heating unit ( 12 ) and configured to supply power to the temperature detection unit ( 10 ) and the heating unit ( 12 ). The first temperature is the lower limit value of the operating temperature of the component ( 16 ), and the second temperature is the upper limit value of the operating temperature of the component ( 16 ). The temperature control device can maintain the operating temperature of an electronic device or a component so that the electronic device and the component thereof overcome a low-temperature obstacle, thereby operating normally.

First claim

What is claimed is:

1. A temperature control device, configured to maintain an operating temperature of a component of an electronic device, comprising:
a temperature detection unit, configured to detect the operating temperature of the component;
a heating unit, configured to heat the component according to a detection result of the temperature detection unit so that the operating temperature is between a first temperature and a second temperature, wherein the heating unit is a heating material converting electric energy into heat energy and the heating material is in a shape of a film covering on the electronic device and/or the component; and
a power supply interface respectively connected to the temperature detection unit and the heating unit and configured to supply power to the temperature detection unit and the heating unit;
wherein the first temperature is a lower limit value of the operating temperature of the component, and the second temperature is an upper limit value of the operating temperature of the component.

2. The temperature control device according to claim 1 , wherein the temperature control device further comprises:
a control unit, connected to the heating unit and configured to start or close the heating unit according to the detection result of the temperature detection unit.

3. The temperature control device according to claim 1 , wherein detecting the operating temperature of the component by the temperature detection unit comprises:
according to a preset time interval, starting a detection function to detect the operating temperature of the component.

4. The temperature control device according to claim 1 , wherein the upper limit value of the operating temperature of the heating unit is smaller than the second temperature; and the lower limit value of the operating temperature of the heating unit is smaller than the first temperature.

5. An electronic device comprising the temperature control device according to claim 1 , wherein the temperature detection unit is provided at the component pre-heated of the electronic device and configured to detect the operating temperature of the component; the heating unit is provided in a reserved space of the electronic device or at the component, and configured to heat the component.

6. The electronic device according to claim 5 , wherein the temperature control device is provided at a first component of the electronic device and configured to control the operating temperature of the first component.

7. The electronic device according to claim 5 , wherein the temperature control device is provided between the first component and a second component of the electronic device, and configured to control the operating temperature of the first component and the second component.

8. The electronic device according to claim 6 , wherein the first component is a printed circuit board made of a heat conduction material, and the printed circuit board is a heating equipment of the temperature control device.

9. The electronic device according to claim 5 , wherein the first component further comprises a processing module and a storage module;
a control unit of the temperature control device is integrated with the first component; the control unit shares the processing module and the storage module with the first component.

10. A temperature control method, configured to maintain an operating temperature of a component of an electronic device, comprising:
obtaining a current temperature of the component;
determining whether the current temperature is between a first temperature and a second temperature and obtain a determination result;
when the determination result indicates that the current temperature is lower than the first temperature, controlling the current temperature to be between the first temperature and the second temperature;
wherein the first temperature is a lower limit value of an operating temperature of the component, and the second temperature is an upper limit value of the operating temperature of the component, and
wherein a heating unit is configured to heat the component and/or the electronic device according to the current temperature, to control the current temperature to be between the first temperature and the second temperature, and the heating unit is a heating material converting electric energy into heat energy and is in a shape of a film covering on the electronic device and/or the component.

11. The electronic device according to claim 7 , wherein the first component is a printed circuit board made of a heat conduction material, and the printed circuit board is a heating equipment of the temperature control device.

Assignees

• Song Jingshan
• Zte Corp

Inventors

• Song Jingshan

Classifications

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• G05D23/1919 Primary

  characterised by the type of controller · CPC title

• H05K7/20 Primary

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05B3/26

  heating conductor mounted on insulating base {(for transparent areas H05B3/84, H05B3/86)} · CPC title