Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-11935775-B2
Application number	US-202017117979-A
Country	US
Kind code	B2
Filing date	Dec 10, 2020
Priority date	Mar 17, 2020
Publication date	Mar 19, 2024
Grant date	Mar 19, 2024

Abstract

According to one embodiment, there is provided a semiconductor manufacturing apparatus including a rotatable substrate stage, a first measuring mechanism and a second measuring mechanism. On the rotatable substrate stage, a laminated substrate used for manufacturing a semiconductor device is placed. The laminated substrate is formed by a first substrate and a second substrate to be laminated to each other. The first measuring mechanism measures an edge of the first substrate and an edge of the second substrate from a first direction. The second measuring mechanism measures the edge of the first substrate and the edge of the second substrate from a second direction. The second direction is a direction different from the first direction in an angle to a normal of the first substrate.

First claim

What is claimed is:

1. A semiconductor manufacturing apparatus comprising:
a rotatable substrate stage on which a laminated substrate used for manufacturing a semiconductor device is placed, the laminated substrate being formed by a first substrate and a second substrate to be laminated to each other;
a first measuring mechanism that measures an edge of the first substrate and an edge of the second substrate in a first direction;
a second measuring mechanism that measures the edge of the first substrate and the edge of the second substrate in a second direction, the second direction being a direction different from the first direction in an angle to a normal of the first substrate; and
a controller configured to determine a center position of the first substrate and a center position of the second substrate according to a measurement result of the first measuring mechanism and a measurement result of the second measuring mechanism.

2. The semiconductor manufacturing apparatus according to claim 1 , wherein
the first direction is a direction along the normal of a surface of the first substrate, and
the second direction is a direction along the surface of the first substrate.

3. The semiconductor manufacturing apparatus according to claim 1 , wherein
the controller controls a measurement operation of the first measuring mechanism and a measurement operation of the second measuring mechanism in parallel, and acquires the measurement result of the first measuring mechanism and the measurement result of the second measuring mechanism in parallel.

4. The semiconductor manufacturing apparatus according to claim 1 , wherein
the controller sequentially controls a measurement operation of the first measuring mechanism and a measurement operation of the second measuring mechanism, and sequentially acquires the measurement result of the first measuring mechanism and the measurement result of the second measuring mechanism.

5. The semiconductor manufacturing apparatus according to claim 1 , wherein
the controller determines a center position of the laminated substrate according to the center position of the first substrate and the center position of the second substrate.

6. The semiconductor manufacturing apparatus according to claim 5 , wherein
the controller determines the center position of the first substrate or the center position of the second substrate to be the center position of the laminated substrate.

7. The semiconductor manufacturing apparatus according to claim 5 , wherein
the controller determines a midpoint between the center position of the first substrate and the center position of the second substrate to be the center position of the laminated substrate.

8. The semiconductor manufacturing apparatus according to claim 1 , further comprising
a trimming mechanism that trims at least one of an outer periphery of the first substrate and an outer periphery of the second substrate, wherein
the controller determines a center position of the laminated substrate according to the center position of the first substrate and the center position of the second substrate, and controls the trimming mechanism according to the center position of the laminated substrate.

9. The semiconductor manufacturing apparatus according to claim 8 , wherein
the controller causes the trimming mechanism to trim an edge of the laminated substrate in a state where the center position of the laminated substrate aligns with a rotation center of the substrate stage.

10. The semiconductor manufacturing apparatus according to claim 1 , wherein
the controller obtains a distance between the center position of the first substrate and the center position of the second substrate according to the center position of the first substrate and the center position of the second substrate, and determines whether the distance is within an allowable range.

11. The semiconductor manufacturing apparatus according to claim 1 , further comprising
a third measuring mechanism that measures a reference position on the first substrate in a third direction, the third direction being different from the first direction and the second direction in an angle to the normal of the first substrate.

12. A method of manufacturing a semiconductor device, comprising:
measuring an edge of a first substrate and an edge of a second substrate of a laminated substrate used for manufacturing a semiconductor device, the laminated substrate being formed by the first substrate and the second substrate to be laminated to each other;
determining a center position of the first substrate and a center position of the second substrate according to a result of the measuring; and
determining a center position of the laminated substrate according to the center position of the first substrate and the center position of the second substrate.

13. The method of manufacturing a semiconductor device according to claim 12 , wherein
the measuring includes:
measuring the edge of the first substrate and the edge of the second substrate in a first direction; and
measuring, according to a result of the measuring in the first direction, the edge of the first substrate and the edge of the second substrate in a second direction, the second direction being different from the first direction in an angle to a normal of the first substrate.

14. The method of manufacturing a semiconductor device according to claim 13 , wherein
the first direction is a direction along the normal of a surface of the first substrate, and
the second direction is a direction along the surface of the first substrate.

15. The method of manufacturing a semiconductor device according to claim 12 , wherein
the determining the center position of the laminated substrate includes determining a midpoint between the center position of the first substrate and the center position of the second substrate to be the center position of the laminated substrate.

16. The method of manufacturing a semiconductor device according to claim 12 , further comprising
trimming an edge of the laminated substrate according to the center position of the laminated substrate.

17. The method of manufacturing a semiconductor device according to claim 12 , further comprising:
obtaining a lamination misalignment between the first substrate and the second substrate according to the center position of the first substrate and the center position of the second substrate; and
determining that the laminated substrate is processable according to the lamination misalignment within an allowable range, or determining that the laminated substrate is unprocessable according to the lamination misalignment outside the allowable range.

18. The method of manufacturing a semiconductor device according to claim 12 , further comprising:
obtaining a lamination misalignment between the first substrate and the second substrate according to the center position of the first substrate and the center position of the second substrate; and
correcting a processing condition according to the lamination misalignment, and processing the laminated substrate under the corrected processing condition.

Assignees

• Kioxia Corp

Inventors

• Nagai Satoshi
• Takakuwa Manabu
• Usui Satoshi

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/06

  Apparatus for monitoring, sorting, marking, testing or measuring · CPC title

• H10P72/53 Primary

  using optical controlling means · CPC title

• H01L21/681 Primary

  Electricity · mapped topic

• H01L21/67092

  Electricity · mapped topic