Method and apparatus for load-locked printing

Patent metadata

Field	Value
Publication number	US-11926902-B2
Application number	US-202217804419-A
Country	US
Kind code	B2
Filing date	May 27, 2022
Priority date	Jun 13, 2008
Publication date	Mar 12, 2024
Grant date	Mar 12, 2024

Abstract

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

First claim

What is claimed is:

1. A method for forming a film on a substrate, the method comprising:
floating a substrate on a flotation system in an isolated substrate-printing region having an inert gas environment, the flotation system comprising at least one gas inlet port and at least one gas outlet port; and
while floating the substrate in the substrate-printing region:
moving the substrate in a first direction and moving at least one print-head in a second direction, the first and second directions being substantially orthogonal to each other,
controlling a float height of the substrate using gas flow through the at least one gas inlet port and the at least one gas outlet port,
detecting a misalignment of the substrate in the first direction and in the second direction,
printing a material on a surface of the substrate using the at least one print-head; and
using the detected misalignment to control printing the material on the surface of the substrate.

2. The method of claim 1 , further comprising transporting the substrate to the substrate-printing region from a substrate-inlet region having an inert gas environment using a transport gas.

3. The method of claim 2 , further comprising receiving the substrate at the substrate-inlet region, isolating the substrate-inlet region, and forming the inert gas environment prior to transporting the substrate to the substrate-printing region.

4. The method of claim 1 , further comprising transporting the substrate from the substrate-printing region to a substrate-outlet region, wherein the substrate-printing region and the substrate-outlet region are enclosed in a housing and separated by a partition.

5. The method of claim 4 , wherein the partition is a gate.

6. The method of claim 4 , further comprising after transporting the substrate to the substrate-outlet region, isolating the substrate-printing region from the substrate-outlet region.

7. The method of claim 1 , wherein using the detected misalignment to control printing the material comprises adjusting position of at least one of the print-head and the substrate based on the misalignment and adjusting print-head firing based on the misalignment.

8. The method of claim 7 , wherein detecting the misalignment comprises identifying an alignment target on the substrate using a camera.

9. The method of claim 1 , further comprising aligning the substrate along the first direction before printing the material on the substrate.

10. A method for forming a film on a substrate, the method comprising:
floating a substrate on a flotation system in a substrate-printing region having an inert gas environment comprising nitrogen gas, the flotation system comprising at least one gas inlet port and at least one gas outlet port; and
while floating the substrate in the substrate-printing region:
moving the substrate in a first direction and moving at least one print-head in a second direction, the first and second directions being substantially orthogonal to each other,
controlling a float height of the substrate using gas flow through the at least one gas inlet port and the at least one gas outlet port, the gas flow comprising an inert gas,
detecting a misalignment of the substrate in the first direction and in the second direction,
printing a material on a surface of the substrate using the at least one print-head having at least one nozzle, and
using the detected misalignment to control printing the material on the surface of the substrate.

11. The method of claim 10 , wherein printing the material on the surface of the substrate comprises printing the material in a pattern on the surface of the substrate.

12. The method of claim 11 , wherein the material is printed in a pattern on the surface of the substrate to form a display device.

13. The method of claim 10 , wherein the material comprises an organic material.

14. The method of claim 13 , wherein the organic material comprises an OLED material.

15. The method of claim 10 , wherein the print-head comprises an ink chamber in flow communication with the at least one nozzle.

16. The method of claim 10 , wherein using the detected misalignment to control printing the material comprises adjusting position of at least one of the print-head and the substrate based on the misalignment and adjusting print-head firing based on the misalignment.

17. The method of claim 10 , wherein:
the at least one print-head comprises an energizing element, and
in response to energizing of the energizing element, the at least one print-head is actuated to dispense a metered quantity of ink.

18. A method for forming a film on a substrate, the method comprising:
receiving a substrate in a substrate-inlet region of a printing system enclosure;
isolating the substrate-inlet region;
establishing an inert gas environment in the substrate-inlet region;
transporting the substrate from the substrate-inlet region to a substrate-printing region of the printing system enclosure;
floating the substrate on a flotation system in the substrate-printing region, the flotation system comprising at least one gas inlet port and at least one gas outlet port;
establishing an inert gas environment in the substrate-printing region; and
while floating the substrate in the substrate-printing region:
scanning the substrate in a first direction,
controlling a float height of the substrate using gas flow through the at least one gas inlet port and the at least one gas outlet port, the gas flow comprising an inert gas,
detecting a misalignment of the substrate, in the first direction and in a second direction orthogonal to the first direction, during the scanning of the substrate in the first direction by identifying an alignment target on the substrate using a camera,
printing a material on a surface of the substrate using the at least one print-head; and
during printing the material of the surface of the substrate, adjusting at least one of the position of the print-head, the position of the substrate, and firing the print-head based on the misalignment.

19. The method of claim 18 , wherein the substrate-inlet region is also a substrate-outlet region of the printing system enclosure.

20. The method of claim 18 , wherein the material comprises an organic material.

Assignees

• Kateeva Inc

Inventors

• Somekh Sass
• Vronsky Eliyahu
• Madigan Conor F

Classifications

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/36

  using air tracks · CPC title

• B41J2/16523

  Waste ink transport from caps or spittoons, e.g. by suction (Collecting or collectors of waste ink B41J2/1721) · CPC title

• B41J2/16508

  connected with the printer frame · CPC title

• C23C4/137 Primary

  Spraying in vacuum or in an inert atmosphere · CPC title