Method and apparatus for load-locked printing

US9174433B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9174433-B2
Application numberUS-201313774683-A
CountryUS
Kind codeB2
Filing dateFeb 22, 2013
Priority dateJun 13, 2008
Publication dateNov 3, 2015
Grant dateNov 3, 2015

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for depositing an organic material on a substrate, the method comprising the steps of: receiving the substrate at an inlet chamber; sealing the inlet chamber; providing the inlet chamber with a substantially nitrogen environment; floating the substrate using a gas bearing; directing at least a portion of the substrate to a print-head chamber and, while floating the substrate using a combination of pressure and vacuum, discharging a quantity of the organic material from a discharge nozzle onto the portion of the substrate; directing the substrate to an outlet chamber; partitioning the print-head chamber from the outlet chamber; and unloading the substrate from the outlet chamber. 2. The method of claim 1 , further comprising executing at least one intermediate processing step on the substrate before directing at least a portion of the substrate to the print-head chamber. 3. The method of claim 2 , wherein said at least one intermediate processing step comprises registering the substrate relative to a print-head of the print-head chamber. 4. The method of claim 1 , wherein a conveying mechanism is used to carry out said step of directing the substrate. 5. The method of claim 1 , wherein said discharging step forms a patterned film on the substrate. 6. A method for depositing an organic material on a substrate, the method comprising the steps of: receiving the substrate at an inlet chamber; sealing the inlet chamber; providing the inlet chamber with a substantially chamber-gas environment, the chamber gas being substantially inert to the organic material; floating the substrate using a gas bearing; directing at least a portion of the substrate to a print-head chamber and, while floating the substrate using a combination of pressure and vacuum, discharging a quantity of the organic material from a discharge nozzle onto the portion of the substrate, forming a patterned film thereon; directing the substrate to an outlet chamber; and, unloading the substrate from the outlet chamber. 7. The method of claim 6 , wherein said chamber gas comprises a substantially pure gas selected from the group consisting of clean dry air, nitrogen, argon, hydrogen, helium, or any combination of the foregoing. 8. The method of claim 6 , further comprising executing at least one intermediate processing step on the substrate before directing at least a portion of the substrate to the print-head chamber. 9. The method of claim 8 , wherein said at least one intermediate processing step comprises registering the substrate relative to a print-head of the print-head chamber. 10. The method of claim 6 , wherein a conveying mechanism is used to carry out said step of directing the substrate. 11. A method for depositing an organic material on a substrate, the method comprising the steps of: receiving the substrate at an inlet chamber; sealing the inlet chamber; providing the inlet chamber with a substantially inert-gas environment; floating the substrate using a gas bearing; directing at least a portion of the substrate to a print-head chamber and, while floating the substrate using a combination of pressure and vacuum, discharging a quantity of the organic material from a discharge nozzle onto the portion of the substrate, forming a patterned film thereon; directing the substrate to an outlet chamber; and, unloading the substrate from the outlet chamber. 12. The method of claim 11 , further comprising executing at least one intermediate processing step on the substrate before directing at least a portion of the substrate to the print-head chamber. 13. The method of claim 12 , wherein said at least one intermediate processing step comprises registering the substrate relative to a print-head of the print-head chamber. 14. The method of claim 11 , wherein a conveying mechanism is used to carry out said step of directing the substrate. 15. The method of claim 11 , wherein said substantially inert-gas environment is comprised of nitrogen. 16. A method for depositing an organic material on a substrate, the method comprising the steps of: providing a housing comprising a plurality of chambers, including a first chamber, a second chamber, and a print-head chamber; introducing the substrate into the housing; providing at least one of the chambers with a substantially non-oxidizing environment; floating the substrate in at least one of the chambers using a gas bearing; directing at least a portion of the substrate to the print-head chamber and, while floating the substrate using a combination of pressure and vacuum, discharging a quantity of the organic material from a discharge nozzle onto the portion of the substrate; directing the substrate away from the print-head chamber; partitioning the print-head chamber from at least one of the other chambers; and removing the substrate from the housing. 17. The method of claim 16 , further comprising executing at least one intermediate processing step on the substrate before directing at least a portion of the substrate to the print-head chamber. 18. The method of claim 17 , wherein said at least one intermediate processing step comprises registering the substrate relative to a print-head of the print-head chamber. 19. The method of claim 16 , wherein, during said discharging step, said partitioning step isolates the environments of the print-head chamber and the first chamber from each other. 20. The method of claim 16 , wherein a conveying mechanism is used to carry out said step of directing the substrate. 21. The method of claim 16 , wherein said discharging step forms a patterned film on the substrate.

Assignees

Inventors

Classifications

  • characterised by the construction of the load-lock chamber · CPC title

  • using air tracks · CPC title

  • Ink jet technology used for manufacturing optical filters · CPC title

  • spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices · CPC title

  • Apparatus or processes specially adapted to the manufacture of electroluminescent light sources · CPC title

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What does patent US9174433B2 cover?
The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or…
Who is the assignee on this patent?
Kateeva Inc
What technology area does this patent fall under?
Primary CPC classification B41J2/015. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).