Mutliple dielectrics for gate-all-around transistors
US-2020258786-A1 · Aug 13, 2020 · US
US11926039B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11926039-B2 |
| Application number | US-202017134221-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 25, 2020 |
| Priority date | Dec 25, 2020 |
| Publication date | Mar 12, 2024 |
| Grant date | Mar 12, 2024 |
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A robot according to one or more embodiments may include an arm and a hand. The hand is connected to the arm and supports to convey a wafer. The hand includes a base end portion that is an end of the side connected to an arm, and a distal end portion that is an end of the opposite side of the base end portion. With the hand, a lightened part is formed in at least a part of a first region which is a region of a distal end portion than the center part in the longitudinal direction of the hand.
Opening claim text (preview).
The invention claimed is: 1. A robot for conveying a wafer comprising: an arm; and a hand which connects to the arm and supports to convey the wafer, wherein the hand includes a base end portion which is an end of a side connected to the arm and a distal end portion which is an end of an opposite side of the base end portion, a lightened part is formed in at least a part of a first region in the hand that is a region from a center in a longitudinal direction of the hand to the distal end portion, and the lightened part is formed so as to increase a natural frequency of the arm. 2. The robot according to claim 1 , wherein the first region includes a thick part whose thickness is a first thickness and a thin part whose thickness is smaller than the first thickness, and the lightened part is the thin part. 3. The aligner apparatus according to claim 2 , wherein the lightened part is formed in at least a part of the first region other than the distal end portion. 4. The aligner apparatus according to claim 2 , wherein when an upper side face of the hand in a vertical direction is referred to as an upper face and a lower side face of the hand in a vertical direction is referred to as a lower face, the upper face is flat and a step is formed as a boundary of the thick part and the thin part on the lower face. 5. The robot according to claim 2 , wherein the thin part is formed such that the thickness of the thin part is 60% or less of the first thickness. 6. The robot according to claim 5 , wherein the thickness of the thin part is 30% or more of the first thickness. 7. The robot according to claim 1 , wherein the lightened part is a part where a through hole is formed in the first region. 8. The aligner apparatus according to claim 1 , wherein the lightened part is a portion which is formed into hollow in the first region. 9. The robot according to claim 1 , wherein the lightened part is formed on a lower face of the hand in the first region. 10. The robot according to claim 9 , wherein the lower face of the hand comprises a surface of a side of the hand that does not contact the wafer.
using vacuum or suction, e.g. Bernoulli chucks · CPC title
the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title
Mechanical parts of transfer devices · CPC title
Mechanical parts of transfer devices · CPC title
having fork, comb or plate shaped means for engaging the lower surface on a object to be transported · CPC title
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