Apparatus for treating substrate

Patent metadata

Field	Value
Publication number	US-11923219-B2
Application number	US-202016912762-A
Country	US
Kind code	B2
Filing date	Jun 26, 2020
Priority date	Jun 27, 2019
Publication date	Mar 5, 2024
Grant date	Mar 5, 2024

Abstract

The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.

First claim

What is claimed is:

1. An apparatus for treating a substrate, the apparatus comprising:
a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state;
a support unit configured to support the substrate in the process space;
a fluid supply unit configured to supply the fluid into the process space;
a filler member configured to face the substrate placed on the support unit in the process space; and
a measurement unit configured to measure a state in the process space,
wherein the measurement unit is provided in the filler member, and
wherein the filler member includes,
a housing including a first material, and
a transmissive window including a second material and installed in the housing, the transmissive window capable of transmitting a wireless communication signal therethrough, a heat transfer rate of the first material being higher than a heat transfer rate of the second material.

2. The apparatus of claim 1 , wherein the measurement unit includes temperature sensors.

3. The apparatus of claim 2 , wherein the measurement unit includes a board on which the temperature sensors are provided in an array.

4. The apparatus of claim 2 , wherein the temperature sensors are provided in one or more arrays and are provided on a surface facing the substrate.

5. The apparatus of claim 1 , wherein a hole is formed in the housing, and the transmissive window is provided in the hole.

6. The apparatus of claim 1 , wherein the first material is a metallic material, and the second material is a resin material.

7. The apparatus of claim 1 , wherein the second material is at least one of PEEK, polyamide, or PTFE.

8. The apparatus of claim 1 , wherein
the housing includes an upper member and a lower member,
the transmissive window is between the upper member and the lower member to define an interior space such that the upper member and the lower member define a top and a bottom of the interior space, and the transmissive window defines a respective side of the interior space, and
each of the upper member and the lower member includes a material having a higher heat transfer rate than the second material of the transmissive window.

9. The apparatus of claim 8 , wherein each of the upper member and the lower member includes a metallic material.

10. The apparatus of claim 8 , wherein the second material is a resin material.

11. The apparatus of claim 8 , wherein the measurement unit includes:
one or more sensors;
a battery configured to supply power to the sensors; and
a communication module configured to transmit signals measured by the sensors to an outside.

12. The apparatus of claim 11 , wherein the communication module is adjacent to the transmissive window.

13. The apparatus of claim 1 , wherein the process chamber includes:
an upper body in which the support unit is installed;
a lower body in which the filler member is installed, the lower body being configured to provide the process space together with the upper body;
an actuator configured to move one of the upper body and the lower body relative to the other;
an upper supply line configured to supply the fluid into the process space and provided in the upper body; and
a lower supply line configured to supply the fluid into the process space and provided in the lower body,
wherein the support unit is configured to support the substrate such that a patterned surface of the substrate faces upward, and
wherein the filler member is between the lower supply line and the substrate.

14. The apparatus of claim 13 , wherein
the support unit is configured to support an edge region of a bottom surface of the substrate, and
the filler member is below the support unit in the process space.

15. The apparatus of claim 13 , wherein the measurement unit includes:
one or more sensors; and
a memory configured to store information values measured by the one or more sensors.

16. The apparatus of claim 15 , wherein the measurement unit further includes a battery configured to supply power to the one or more sensors.

17. The apparatus of claim 15 , further comprising:
a connector exposed outside the housing and connected with the memory, the connector being capable of transmission of data in the memory to an outside.

18. The apparatus of claim 1 , wherein the measurement unit further includes one or more of a pressure sensor and a leveling sensor configured to measure posture of the apparatus.

19. An apparatus for treating a substrate, the apparatus comprising:
a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state;
a support unit provided in the process space and configured to support an edge region of a bottom surface of the substrate;
a fluid supply unit configured to supply the fluid into the process space;
a filler member disposed to face the substrate placed on the support unit in the process space, the filler member being located below the support unit; and
a measurement unit provided in the filler member and configured to measure a state in the process space,
wherein the process chamber includes,
an upper body in which the support unit is installed,
a lower body in which the filler member is installed, the lower body being configured to provide the process space together with the upper body,
an actuator configured to move one of the upper body and the lower body relative to the other,
an upper supply line configured to supply the fluid into the process space and provided in the upper body, and
a lower supply line configured to supply the fluid into the process space and provided in the lower body,
wherein the filler member is located between the lower supply line and the substrate,
wherein the measurement unit includes,
a communication module, and
one or more of a temperature sensor, a pressure sensor, and a leveling sensor configured to measure posture of the apparatus,
wherein the filler member includes a housing including a first material and a transmissive window including a second material and installed in the housing, the transmissive window being capable of transfer of a wireless communication signal, and
wherein the first material has a higher heat transfer rate than the second material.

Assignees

• Semes Co Ltd

Inventors

• Choi Youngseop
• Lee Young Hun
• Seo Yong-Jun
• Lee Bok Kyu
• PARK Miso

Classifications

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title