Electronic component and method of manufacturing the same
US-10340072-B2 · Jul 2, 2019 · US
Electronic component and method for manufacturing the same
US11919084B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11919084-B2 |
| Application number | US-202217820786-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 18, 2022 |
| Priority date | Feb 1, 2016 |
| Publication date | Mar 5, 2024 |
| Grant date | Mar 5, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an electronic component comprising irradiating an outer surface of an element body made of a composite material of a resin material and metal powder with laser such that a plurality of particles of the metal powder are exposed from the resin material and make contact with one another, wherein the particles are molten and bonded to one another by irradiating the outer surface with the laser in the irradiating and remain bonded to one another in the electronic component. 2. The method for manufacturing the electronic component according to claim 1 , further including forming a metal film covering the particles on a surface of the element body, which has been irradiated with the laser, by plating the element body after the irradiating. 3. The method for manufacturing the electronic component according to claim 1 , further including applying a plating catalyst to a surface of the element body, which has been irradiated with the laser, between the irradiating of the laser and the forming of the metal film.
Assignees
Inventors
Classifications
made from particles (H01F27/26 takes precedence) · CPC title
- B22F3/24Primary
After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title
Metallic powder coated with organic material · CPC title
with organic materials as the main non-metallic constituent, e.g. resin · CPC title
in the form of particles · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11919084B2 cover?
- An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification B22F3/24. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).