Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device
US-12330212-B2 · Jun 17, 2025 · US
with organic materials as the main non-metallic constituent, e.g. resin · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C32/0094 |
| Official title | {with organic materials as the main non-metallic constituent, e.g. resin} |
| Display label | with organic materials as the main non-metallic constituent, e.g. resin |
| Total patents | 56 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 5 |
| 2017 | 7 |
| 2018 | 3 |
| 2019 | 2 |
| 2020 | 8 |
| 2021 | 8 |
| 2022 | 6 |
| 2023 | 6 |
| 2024 | 8 |
| 2025 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12330212-B2 · Jun 17, 2025 · US
US-2025029758-A1 · Jan 23, 2025 · US
US-12125633-B2 · Oct 22, 2024 · US
US-12030242-B2 · Jul 9, 2024 · US
US-2024186038-A1 · Jun 6, 2024 · US
US-2024177902-A1 · May 30, 2024 · US
US-2024120135-A1 · Apr 11, 2024 · US
US-2024109124-A1 · Apr 4, 2024 · US
US-11919084-B2 · Mar 5, 2024 · US
US-2024021362-A1 · Jan 18, 2024 · US
US-2023420174-A1 · Dec 28, 2023 · US
US-2023339018-A1 · Oct 26, 2023 · US
US-2023191484-A1 · Jun 22, 2023 · US
US-11615903-B2 · Mar 28, 2023 · US
US-2023055157-A1 · Feb 23, 2023 · US
US-2023050123-A1 · Feb 16, 2023 · US
US-2022410469-A1 · Dec 29, 2022 · US
US-2022392687-A1 · Dec 8, 2022 · US
US-2022363865-A1 · Nov 17, 2022 · US
US-11488760-B2 · Nov 1, 2022 · US
Answers are generated from the same data shown on this page.