Mechanisms that transfer light between layers of multi-chip photonic assemblies

Patent metadata

Field	Value
Publication number	US-11914201-B2
Application number	US-202217750082-A
Country	US
Kind code	B2
Filing date	May 20, 2022
Priority date	Sep 23, 2021
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

A multi-chip photonic assembly includes first and second photonic integrated circuits having first and second waveguides vertically stacked such that first vertical dimensions of the first and second waveguides occupy different horizontal planes in the stack. At least one of the first and second waveguides has a region that has a second vertical dimension that is larger than the first vertical dimension and either horizontally overlaps the other waveguide and/or vertically contacts the other waveguide. Light moving through one of the waveguides from the first vertical dimension to the other vertical dimension changes modes vertically so that the light moves from one waveguide to the other.

First claim

What is claimed is:

1. A multi-chip photonic assembly, comprising:
a first photonic integrated circuit including a first waveguide having:
a first region that occupies a first horizontal plane and has a first vertical dimension; and
a second region that has a second vertical dimension that is larger than the first vertical dimension, the second region comprising a first adiabatic taper; and

a second photonic integrated circuit, including a second waveguide, stacked vertically over the first photonic integrated circuit, the second waveguide having:
a third region that occupies a second horizontal plane and has a third vertical dimension; and
a fourth region that has a fourth vertical dimension that is larger than the third vertical dimension, the fourth region comprising a second adiabatic taper; wherein:
the second region is positioned in the second horizontal plane; and
the second region and the fourth region change a mode of light travelling between the first photonic integrated circuit and the second photonic integrated circuit; and
the first adiabatic taper tapers horizontally such that a width of second region decreases from a first side of the second region that faces the fourth region until the second region terminates.

2. The multi-chip photonic assembly of claim 1 , wherein the second region overlaps the fourth region in the first horizontal plane and the second horizontal plane.

3. The multi-chip photonic assembly of claim 2 , further comprising an anti-reflection coating positioned between the second region and the fourth region.

4. The multi-chip photonic assembly of claim 2 , wherein:
the second region and the fourth region cooperate to define a gap between the second region and the fourth region; and
the gap is filled with at least one of air or an optically clear underfill.

5. The multi-chip photonic assembly of claim 1 , wherein:
the second region comprises a first angled facet; and
the fourth region comprises a second angled facet that faces the first angled facet in the first horizontal plane and the second horizontal plane.

6. A multi-chip photonic assembly, comprising:
a first photonic integrated circuit including a first waveguide having:
a first region that occupies a first horizontal plane and has a first vertical dimension; and
a second region that has a second vertical dimension that is larger than the first vertical dimension, the second region comprising a first adiabatic taper; and

a second photonic integrated circuit, including a second waveguide, stacked vertically over the first photonic integrated circuit, the second waveguide having:
a third region that occupies a second horizontal plane and has a third vertical dimension; and
a fourth region that has a fourth vertical dimension that is larger than the third vertical dimension, the fourth region comprising a second adiabatic taper; wherein:
the second region vertically contacts the second waveguide; and
the second region and the fourth region change a mode of light travelling between the first photonic integrated circuit and the second photonic integrated circuit.

7. The multi-chip photonic assembly of claim 6 , wherein the second region vertically contacts the second waveguide via an optically clear adhesive.

8. The multi-chip photonic assembly of claim 6 , further comprising an adiabatic transfer region where the second adiabatic taper vertically overlaps the first adiabatic taper.

9. The multi-chip photonic assembly of claim 6 , wherein the light travels between the first waveguide and the second waveguide where the second region vertically contacts the second waveguide.

10. The multi-chip photonic assembly of claim 6 , further comprising cladding material positioned between the first waveguide and the second waveguide.

11. The multi-chip photonic assembly of claim 6 , wherein the first adiabatic taper tapers opposite the second adiabatic taper.

12. The multi-chip photonic assembly of claim 6 , wherein the second region is positioned proximate the fourth region and opposite the third region.

13. A multi-chip photonic assembly, comprising:
a first photonic integrated circuit including a first waveguide having:
a first region that occupies a first horizontal plane and has a first vertical dimension; and
a second region that has a second vertical dimension that is larger than the first vertical dimension; and

a second photonic integrated circuit, including a second waveguide that occupies a second horizontal plane, stacked vertically over the first photonic integrated circuit; wherein:
the second region is positioned in the second horizontal plane;
the second region changes a mode of light travelling between the first photonic integrated circuit and the second photonic integrated circuit; and
the second region uses interference between optical modes within the second region to transfer the light travelling between the first photonic integrated circuit and the second photonic integrated circuit.

14. The multi-chip photonic assembly of claim 13 , wherein the second region has a uniform horizontal dimension from a first side of the second region that faces the second waveguide to a second side of the second region that is opposite the first side.

15. The multi-chip photonic assembly of claim 13 , wherein the second vertical dimension is uniform from a first side of the second region that faces the second waveguide to a second side of the second region that is opposite the first side.

16. The multi-chip photonic assembly of claim 13 , wherein the first waveguide defines a gap horizontally between the second region and the second waveguide.

17. The multi-chip photonic assembly of claim 13 , wherein the second waveguide has a third vertical dimension that is smaller than the second vertical dimension.

18. A multi-chip photonic assembly, comprising:
a first photonic integrated circuit including a first waveguide having:
a first region that occupies a first horizontal plane and has a first vertical dimension; and
a second region that has a second vertical dimension that is larger than the first vertical dimension, the second region comprising a first waveguide material and a second waveguide material overlaying the first waveguide material and having a lower refractive index than the first waveguide material; and

a second photonic integrated circuit, including a second waveguide, stacked vertically over the first photonic integrated circuit, the second waveguide having:
a third region that occupies a second horizontal plane and has a third vertical dimension; and
a fourth region that has a fourth vertical dimension that is larger than the third vertical dimension, the fourth region comprising a third waveguide material and a fourth waveguide material overlaying third first waveguide material and having a lower refractive index than the third waveguide material; wherein:
the second region is positioned in the second horizontal plane; and
the second region and the fourth region change a mode of light travelling between the first photonic integrated circuit and the second photonic integrated circuit.

19. The multi-chip photonic assembly of claim 18 , wherein:
the first region comprises a first segment of the first waveguide material;
the second region comprises a second segment of the first waveguide material; and
a width of the second segment tapers adiabatically in the second region.

20. The multi-chip photonic assembly of claim 19 , wherein:
the third region comprises a third seg

Assignees

• Apple Inc

Inventors

• Witmer Jeremy D
• Bismuto Alfredo

Classifications

• G02B6/423 Primary

  using guiding surfaces for the alignment · CPC title

• G02B6/4262

  characterised by the shape of the housing (for semiconductor lasers H01S5/02208) · CPC title

• G02B6/12002 Primary

  Three-dimensional structures · CPC title

• G02B6/12004

  Combinations of two or more optical elements · CPC title

• G02B6/1228

  Tapered waveguides, e.g. integrated spot-size transformers (for coupling with fibres G02B6/305) · CPC title