OLED panel with inorganic pixel encapsulating barrier

Patent metadata

Field	Value
Publication number	US-11910657-B2
Application number	US-202318346059-A
Country	US
Kind code	B2
Filing date	Jun 30, 2023
Priority date	Sep 4, 2020
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

First claim

What is claimed is:

1. A device, comprising:
a substrate;
inorganic overhang structures, the inorganic overhang structures having an upper portion having a bottom surface wider than a top surface of a lower portion; and
a plurality of sub-pixels, each sub-pixel comprising:
an anode;
an organic light-emitting diode (OLED) material disposed over the anode;
a cathode disposed over the OLED material, extending under the inorganic overhang structures adjacent to each sub-pixel, the cathode directly contacts a layer of a conductive material disposed under the lower portion; and
an encapsulation layer disposed over the cathode, wherein the encapsulation layer extends under at least a portion of the inorganic overhang structures along a sidewall of the lower portion, and contacts the bottom surface of the upper portion of the inorganic overhang structures.

2. The device of claim 1 , wherein the encapsulation layer further extends along a sidewall of the upper portion.

3. The device of claim 2 , wherein the encapsulation layer further extends along an upper surface of the upper portion.

4. The device of claim 1 , wherein the upper portion includes an underside edge extending past a sidewall of the lower portion.

5. The device of claim 4 , wherein the encapsulation layer further extends along the underside edge of the upper portion.

6. The device of claim 1 , wherein the device comprises a dot-type architecture or a line-type architecture.

7. The device of claim 1 , further comprising a global passivation layer disposed over the inorganic overhang structures and the encapsulation layer.

8. A device, comprising:
a substrate;
inorganic overhang structures, the inorganic overhang structures having an upper portion having a bottom surface wider than a top surface of a lower portion, the bottom surface of the upper portion is planar to the top surface of the lower portion; and
a plurality of sub-pixels, each sub-pixel comprising:
an anode;
an organic light-emitting diode (OLED) material disposed over the anode;
a cathode disposed over the OLED material, extending under the inorganic overhang structures adjacent to each sub-pixel, the cathode directly contacts a layer of a conductive material disposed under the lower portion; and
an encapsulation layer disposed over the cathode, wherein the encapsulation layer extends under at least a portion of the inorganic overhang structures along a sidewall of the lower portion, and contacts the bottom surface of the upper portion of the inorganic overhang structures.

9. The device of claim 8 , wherein the encapsulation layer further extends along a sidewall of the upper portion.

10. The device of claim 9 , wherein the encapsulation layer further extends along an upper surface of the upper portion.

11. The device of claim 8 , wherein the upper portion includes an underside edge extending past a sidewall of the lower portion.

12. The device of claim 11 , wherein the encapsulation layer further extends along the underside edge of the upper portion.

13. The device of claim 8 , wherein the device comprises a dot-type architecture or a line-type architecture.

14. The device of claim 8 , further comprising a global passivation layer disposed over the inorganic overhang structures and the encapsulation layer.

15. A device, comprising:
a substrate;
inorganic overhang structures, wherein each of the inorganic overhang structures comprises:
a lower portion; and
an upper portion, the upper portion including first and second extensions extending laterally past first and second sidewalls of the lower portion, respectively; and

a first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over the first anode;
a first cathode disposed over the first OLED material, extending under the first extension of the upper portion, the first cathode directly contacts a layer of a conductive material disposed under the lower portion; and
a first encapsulation layer disposed over the first cathode, wherein the first encapsulation layer extends to contact the lower portion of a first inorganic overhang structure at a first sidewall, to contact the upper portion of the first inorganic overhang structure at a first underside surface of the first extension, and extends over at least a first portion of a top surface of the upper portion of the first inorganic overhang structure.

16. The device of claim 15 , wherein the first encapsulation layer further extends along a sidewall of the upper portion.

17. The device of claim 16 , wherein the first encapsulation layer further extends along an upper surface of the upper portion.

18. The device of claim 15 , wherein the upper portion includes an underside edge extending past a sidewall of the lower portion.

19. The device of claim 18 , wherein the first encapsulation layer further extends along the underside edge of the upper portion.

20. The device of claim 15 , further comprising a global passivation layer disposed over the inorganic overhang structures and the first encapsulation layer.

21. The device of claim 1 , wherein the layer is disposed above a PDL structure disposed over the substrate.

22. The device of claim 8 , wherein the layer is disposed above a PDL structure disposed over the substrate.

23. The device of claim 15 , wherein the layer is disposed above a PDL structure disposed over the substrate.

Assignees

• Applied Materials Inc

Inventors

• Choung Ji-Young
• Haas Dieter
• Lin Yu Hsin
• Lee Jungmin
• Yoo Seong Ho
• Kim Si Kyoung

Classifications

• H10K50/844 Primary

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K50/84

  Passivation; Containers; Encapsulations · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K59/1315

  comprising structures specially adapted for lowering the resistance · CPC title