Conductive oxide overhang structures for OLED devices

Patent metadata

Field	Value
Publication number	US-11348983-B1
Application number	US-202217647214-A
Country	US
Kind code	B1
Filing date	Jan 6, 2022
Priority date	Apr 23, 2021
Publication date	May 31, 2022
Grant date	May 31, 2022

Abstract

Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

First claim

What is claimed is:

1. A device, comprising:
a substrate;
pixel-defining layer (PDL) structures disposed over the substrate;
overhang structures disposed over an upper surface of the PDL structures;
a plurality of sub-pixels, each sub-pixel is defined by a first overhang structure and a second overhang structure adjacent to each other, the first overhang structure and the second overhang structure having:
a base portion disposed over the upper surface a PDL structure of the PDL structures, the base portion comprising a first metal of a first composition;
a body portion disposed on the base portion, the body portion comprising a second metal of a second composition different from the first composition, wherein a bottom surface of the body portion has a width less than or equal to a top surface of the base portion; and
a top portion disposed on the body portion, the top portion comprising a third metal of a third composition different than the first composition and the second composition, a first extension of the top portion of the first overhang structure extending laterally past first sidewalls of the base portion and the body portion, and a second extension of the top portion of the second overhang structure extending laterally past second sidewalls of the base portion and the body portion;

each sub-pixel comprises:
an anode;
an organic light-emitting diode (OLED) material disposed over and in direct contact with the anode;
a cathode disposed over the OLED material, the cathode extending under the first extension of the top portion of the first overhang structure and the second extension of the top portion of the second overhang structure, wherein the cathode directly contacts at least a sidewall of the first overhang structure; and
an encapsulation layer disposed over the cathode, wherein the encapsulation layer extends:
to directly contact the second metal of the second composition of the body portion;
to directly contact the third metal of the third composition of the top portion at an underside surface of the first extension and the second extension; and
over at least a first portion of a top surface of the first extension of the first overhang structure and the second extension of the second overhang structure of the top portion.

2. The device of claim 1 , wherein the first composition comprises at least one of:
a transition metal;
a transition metal oxide (TMO) material; or
a transparent conductive oxide (TCO) material.

3. The device of claim 2 , wherein:
the transition metal comprises ruthenium (Ru), vanadium (V), titanium (Ti), zinc (Zn), copper (Cu), molybdenum (Mo), or combinations thereof;
the TMO material comprises one or more oxides of the transition metal; and
the TCO material comprises one or more of indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin oxide (ITO), or combinations thereof.

4. The device of claim 1 , wherein the second composition comprises a metal alloy material.

5. The device of claim 4 , wherein the metal alloy material comprises copper (Cu), titanium (Ti), aluminum (Al), molybdenum (Mo), silver (Ag), tin (Sn), or combinations thereof.

6. The device of claim 4 , wherein the body portion further comprises a metal oxide surface.

7. The device of claim 6 , wherein the metal oxide surface comprises one or more oxides of the metal alloy material.

8. The device of claim 1 , wherein the third metal comprises Ti, Cu, Mo, ITO, IZO, or combinations thereof.

9. The device of claim 1 , wherein adjacent overhangs of the overhang structures are defined by:
an overhang width from a sidewall of the base portion to an underside edge of the top portion; and
an overhang depth from the upper surface of the PDL structure to the underside edge of the top portion.

10. The device of claim 9 , wherein the overhang width of each of the overhang structures are about 0.5 μm (micrometers) to about 1 μm are within 15 percent of each other.

11. The device of claim 1 , wherein the encapsulation layer extends to contact the first metal of the first composition of the base portion at a first sidewall of the base portion.

12. The device of claim 1 , wherein each sub-pixel further comprises a plug disposed over the encapsulation layer, the plug having a plug transmittance that is matched or substantially matched to an OLED transmittance of the OLED material.

13. The device of claim 1 , further comprising a global encapsulation layer disposed over the first overhang structure, the second overhang structure, and the encapsulation layer.

14. The device of claim 1 , wherein the device comprises a dot-type architecture or a line-type architecture.

15. The device of claim 1 , wherein the substrate is a pre-patterned indium tin oxide (ITO) glass substrate.

16. A device, comprising:
a substrate;
pixel-defining layer (PDL) structures disposed over the substrate;
overhang structures disposed over an upper surface of the PDL structures;
a plurality of sub-pixels, each sub-pixel is defined by a first overhang structure and a second overhang structure adjacent to each other, the first overhang structure and the second overhang structure having:
a base portion disposed over the upper surface a PDL structure of the PDL structures, the base portion comprising a first metal of a first composition;
a body portion disposed on the base portion, the body portion comprising a second metal of a second composition different from the first composition, wherein a bottom surface of the body portion has a width less than or equal to a top surface of the base portion; and
a top portion disposed on the body portion, the top portion comprising a third metal of a third composition different than the first composition and the second composition, a first extension of the top portion of the first overhang structure extending laterally past first sidewalls of the base portion and the body portion, and a second extension of the top portion of the second overhang structure extending laterally past second sidewalls of the base portion and the body portion;

each sub-pixel comprises:
an anode;
an organic light-emitting diode (OLED) material disposed over and in direct contact with the anode;
a cathode disposed over the OLED material, the cathode extending under the first extension of the top portion of the first overhang structure and the second extension of the top portion of the second overhang structure, wherein the cathode directly contacts at least a first sidewall of the base portion of the first overhang structure; and
an encapsulation layer disposed over the cathode, wherein the encapsulation layer extends:
to directly contact the first metal of the first composition of the base portion at the first sidewall
extends to directly contact the body portion of the first overhang structure and the second overhang structure;
to directly contact the third metal of the third composition of the top portion at an underside surface of the first extension and the second extension; and
over at least a first portion of a top surface of the first extension of the first overhang structure and the second extension of the second overhang structure of the top portion.

Assignees

• Applied Materials Inc

Inventors

• Choung Ji-Young
• Chen Chung-Chia
• Lin Yu Hsin
• Lee Jungmin
• Haas Dieter
• Kim Si Kyoung

Classifications

• H10K59/80522

  combined with auxiliary electrodes · CPC title

• H10K59/873 Primary

  Encapsulations · CPC title

• H10K59/80521

  characterised by their shape · CPC title

• H10K2102/00

  Constructional details relating to the organic devices covered by this subclass · CPC title

• H10K59/122 Primary

  Pixel-defining structures or layers, e.g. banks · CPC title