Compliant polishing pad and polishing module

Patent metadata

Field	Value
Publication number	US-9751189-B2
Application number	US-201414476991-A
Country	US
Kind code	B2
Filing date	Sep 4, 2014
Priority date	Jul 3, 2014
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A polishing device includes a housing, a flexible base coupled to the housing, and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base.

First claim

The invention claimed is:

1. A polishing device, comprising:
a support arm extending in a first direction over a circular chuck from a perimeter of the chuck;
a movement mechanism coupled to the support arm;
a housing fixed to the support arm in a second direction that is orthogonal to the first direction;
a flexible base coupled to the housing; and
a contact region disposed on a first side of the flexible base and protruding from the flexible base, the contact region bein…

Assignees

• Applied Materials Inc

Inventors

• Chen Chih Hung
• Gurusamy Jay
• Zuniga Steven M

Classifications

• B24B37/10

  Operations & Transport · mapped topic

• B24B41/047 Primary

  Operations & Transport · mapped topic

• H10P52/402

  Electricity · mapped topic

• H10P52/00 Primary

  Electricity · mapped topic