Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant

Patent metadata

Field	Value
Publication number	US-11904073-B2
Application number	US-202217975245-A
Country	US
Kind code	B2
Filing date	Oct 27, 2022
Priority date	Nov 29, 2018
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

First claim

What is claimed is:

1. A biocompatible electrical connector, comprising:
a substrate comprising a ceramic material;
a ferrule comprising a concentric flange at a first end of the ferrule;
a first adhesive; and
a second adhesive,
wherein:
the first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate,
the second adhesive fills an annular space between a hole in the substrate and the ferrule, and
the first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern formed directly on the substrate.

2. The biocompatible electrical connector of claim 1 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink or a gold ink or a combination thereof.

3. The biocompatible electrical connector of claim 1 , wherein the conductive path is screen-printed on the surface of the substrate.

4. The biocompatible electrical connector of claim 1 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material or an implant grade stainless steel.

5. A method for forming a biocompatible electrical connection, the method comprising:
applying a first adhesive on a surface of a substrate around a circumference of a hole in the substrate, wherein the substrate comprises a ceramic material;
inserting a ferrule comprising a concentric flange at a first end into the hole, wherein the first adhesive adheres a first surface of the concentric flange to the surface of the substrate;
filling an annular space between the hole and the ferrule with a second adhesive; and
forming a conductive path between the ferrule and a circuit pattern formed directly on the surface of the substrate using the first adhesive or the second adhesive.

6. The method of claim 5 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink or a gold ink or a combination thereof.

7. The method of claim 5 , further comprising screen-printing the conductive path on the surface of the substrate.

8. The method of claim 5 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material or an implant grade stainless steel.

9. A biocompatible device, comprising:
electronic circuitry enclosed in a conductive biocompatible housing;
a biocompatible antenna disposed external to the conductive biocompatible housing and electrically connected to the electronic circuitry; and
a biocompatible electrical connector configured to electrically connect the biocompatible antenna to the electronic circuitry,
wherein the biocompatible electrical connector comprises:
a ferrule having a concentric flange at a first end of the ferrule;
a first adhesive;
a second adhesive; and
a substrate comprising a ceramic material,

wherein the first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate,
wherein the second adhesive fills an annular space between a hole in the substrate and the ferrule, and
the first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern formed directly on the substrate.

10. The biocompatible device of claim 9 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink or a gold ink or a combination thereof.

11. The biocompatible device of claim 9 , wherein the conductive path is screen-printed on the surface of the substrate.

12. The biocompatible device of claim 9 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material or an implant grade stainless steel.

Assignees

• Verily Life Sciences Llc

Inventors

• Loo Alexander
• Patron Damiano
• Page Matthew

Classifications

• A61L31/026 Primary

  Ceramic or ceramic-like structures, e.g. glasses · CPC title

• H01Q1/273 Primary

  Adaptation for carrying or wearing by persons or animals · CPC title

• H01Q23/00

  Antennas with active circuits or circuit elements integrated within them or attached to them · CPC title

• H01R4/029

  Welded connections (H01R4/021 - H01R4/028 take precedence) · CPC title

• H01R4/04

  using electrically conductive adhesives · CPC title