Electrical Feedthrough Assembly

Patent metadata

Field	Value
Publication number	US-2016106988-A1
Application number	US-201514873987-A
Country	US
Kind code	A1
Filing date	Oct 2, 2015
Priority date	Jan 8, 2013
Publication date	Apr 21, 2016
Grant date	—

Abstract

A device includes a hermetically sealed case with electronic circuitry housed within. One surface of the hermetically sealed case includes a metallic plate and a co-fired ceramic electrical feedthrough with a number of vias. The co-fired ceramic electrical feedthrough is hermetically joined to the metallic plate and a hybrid circuit is connected to the feedthrough.

First claim

1 - 23 . (canceled)

24 . A device comprising:
a hermetically sealed case with electronic circuitry housed within; wherein one surface of the hermetically sealed case comprises: a metallic plate, a co-fired ceramic electrical feedthrough being hermetically joined to the metallic plate, the feedthrough comprising:
a number of vias; and
a number of pads located on a first side of the feedthrough, each pad being electrically connected to at most one via, wherein a via connected to a pad extends laterally beyond a footprint of the pad; and
a circuit electrically coupled to vias of the feedthrough.

25 . The device of claim 24 , wherein a first via extends orthogonal to a first pad through two or more adjacent outer layers of the multilayered co-fired ceramic feedthrough and jogs between central layers of the multilayered co-fired ceramic feedthrough.

26 . The device of claim 24 , wherein a first via has a different geometry from a second via.

27 . The device of claim 24 , wherein a thickness of the ceramic feedthrough is less than a thickness of the metallic plate.

28 . The device of claim 24 , wherein an interior surface of the feedthrough is displaced relative to an interior surface of the metallic plate.

29 . The device of claim 24 , wherein a set of connections to the vias can only be made in one rotational orientation.

30 . The device of claim 24 , wherein a first width of a first via is greater than a second width of a second via.

31 . The device of claim 30 , comprising a plurality of vias of the first width and a plurality of vias of the second width.

32 . The device of claim 31 , wherein a pad on a first side of a via and pad on a second side of a via occupy different locations on the respective sides of the feedthrough.

33 . A device, a feedthrough for a hermetically sealed case, the feedthrough comprising:
a co-fired ceramic matrix; two vias of a first cross-section; and multiple vias of a second cross-section, wherein a first line passes through a center of each of the two vias of a first cross-section and a second line through a center of each of the multiple vias of a second cross-section, wherein the first and second lines are parallel to each other.

34 . The device of claim 33 , wherein the first and second lines do not coincide with a diameter of the feedthrough.

35 . The device of claim 33 , wherein the multiple vias of a second cross-section are connected to pads on a first and a second side of the ceramic matrix, the pads on the first side of the ceramic matrix being composed of a different material than the pads on the second side of the ceramic matrix.

36 . The device of claim 33 , wherein a composition of a via changes through a thickness of the feedthrough.

37 . The device of claim 33 , further comprising a first and second via of the second cross sectional area wherein thermally induced mechanical stresses from the first and second vias are generated in different directions from each other.

38 . The device of claim 33 , wherein a first via the second cross section and a second via of the second cross section have different geometries.

39 . A method of forming a ceramic feedthrough for a hermetically sealed case, the method comprising:
forming multiple stacked layers comprising green sheet material and metal, wherein the metal forms multiple vias through the stacked layers and a first via and a second via have different geometries; and co-firing the multiple stacked layers.

40 . The method of claim 39 , wherein a geometry of a via extends out of plane.

41 . The method of claim 39 , further comprising attaching pads to both ends of the first via, wherein a pad on a first end of the first via comprises a different material than a pad on the second end of the first via.

42 . The method of claim 39 , further comprising attaching the feedthrough to a case using a brazing composition that comprises ceramic particulate.

43 . The method of claim 39 , wherein a third via and a fourth via have a common geometry.

Assignees

• Advanced Bionics Ag

Inventors

• Koester Kurt J
• Thenuwara Chuladatta
• Beerling Timothy
• Downing Mark B
• Stuursma David
• Palmer Logan P

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W76/153

  having interconnections in passages through the insulating or insulated base · CPC title

• H10W76/132

  having other interconnections through an insulated passage in the conductive base · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W72/019

  of bond pads · CPC title