Emi filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device

Patent metadata

Field	Value
Publication number	US-2016263384-A1
Application number	US-201615164945-A
Country	US
Kind code	A1
Filing date	May 26, 2016
Priority date	Jan 16, 2012
Publication date	Sep 15, 2016
Grant date	—

Abstract

A hermetically sealed feedthrough filter assembly is attachable to an active implantable medical device and includes an insulator substrate assembly and a feedthrough filter capacitor disposed on a device side. A conductive leadwire has a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD. The distal leadwire end is disposed at least partially through a first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near a device side conductive fill. A first electrically conductive material makes a three-way electrically connection that electrically connects the device side conductive fill to an internal metallization of the feedthrough filter capacitor and to the distal leadwire end. A second electrically conductive material electrically connects an external metallization of the feedthrough filter capacitor to a ferrule or an AIMD housing.

First claim

What is claimed is:

1 . A hermetically sealed feedthrough filter assembly attachable to an active implantable medical device (AIMD), the feedthrough filter assembly comprising:
a) an insulator substrate assembly, comprising:
i) an insulator body separating a first side from a second side;
ii) a via hole disposed through the insulator body extending from the first side to the second side;
iii) a conductive fill disposed within the via hole forming a filled via electrically conductive between the first side and the second side;
iv) a first hermetic seal between the filled via and the insulator body;
b) a ferrule, comprising:
i) a conductive ferrule body defining a ferrule opening;
ii) a second hermetic seal between the insulator body and the conductive ferrule body, wherein the ferrule opening is hermetically sealed by the insulator body;
c) a feedthrough filter capacitor disposed on the second side, the feedthrough filter capacitor comprising:
i) an active electrode plate disposed parallel and spaced from a ground electrode plate, wherein the plates are disposed within a capacitor dielectric substrate;
ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the plates;
iii) an internal metallization disposed within the first passageway electrically connected to the active electrode plate and in non-conductive relation with the ground electrode plate;
iv) an external metallization disposed on an outside surface of the capacitor dielectric substrate and electrically connected to the ground electrode plate and in non-conductive relation with the active electrode plate;
d) a conductive leadwire having a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD, and wherein the distal leadwire end is disposed at least partially through the first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near the second side conductive fill; e) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the second side conductive fill to the internal metallization of the feedthrough filter capacitor and to the distal leadwire end; and f) a second electrically conductive material electrically connecting the external metallization of the feedthrough filter capacitor to the ferrule.

2 . The feedthrough filter assembly of claim 1 , wherein the first electrically conductive material is selected from the group consisting of a solder, a solder BGA, a solder paste, an epoxy, and a polyimide.

3 . The feedthrough filter assembly of claim 1 , wherein the first hermetic seal has a leak rate no greater than 1×10 −7 std cc He/sec.

4 . The feedthrough filter assembly of claim 1 , wherein the conductive fill of the filled via comprises a substantially closed pore and fritless platinum fill.

5 . The feedthrough filter assembly of claim 4 , wherein the first hermetic seal comprises a tortuous and mutually conformal knitline between the via hole and the platinum fill.

6 . The feedthrough filter assembly of claim 5 , wherein the knitline comprises a glass that is at least about 60% silica.

7 . The feedthrough filter assembly of claim 1 , wherein the insulator body comprises at least 96% alumina.

8 . The feedthrough filter assembly of claim 1 , wherein the insulator body comprises at least 99% alumina.

9 . The feedthrough filter assembly of claim 1 , including an adhesion metallization disposed on an outer surface of the insulator body.

10 . The feedthrough filter assembly of claim 9 , including a wetting metallization disposed on the adhesion metallization.

11 . The feedthrough filter assembly of claim 10 , wherein the second hermetic seal comprises a gold braze, wherein the gold braze connects between the wetting metallization and the conductive ferrule body.

12 . The feedthrough filter assembly of claim 11 , wherein the second hermetic seal has a leak rate no greater than 1×10 −7 std cc He/sec.

13 . The feedthrough filter assembly of claim 11 , wherein the second electrically conductive material is in contact with the gold braze of the second hermetic seal.

14 . The feedthrough filter assembly of claim 1 , wherein an insulative washer is disposed between the insulator substrate assembly and the feedthrough filter capacitor.

15 . The feedthrough filter assembly of claim 1 , wherein the via hole extending through the insulator body to the first side and second side is staggered.

16 . The feedthrough filter assembly of claim 1 , wherein the ferrule is configured to be joined to an AIMD housing by a laser weld or braze.

17 . The feedthrough filter assembly of claim 1 , wherein the ferrule is formed from and as a continuous part of an AIMD housing.

18 . The feedthrough filter assembly of claim 1 , wherein the first side is a body fluid side and the second side is a device side.

19 . A hermetically sealed feedthrough filter assembly attachable to an active implantable medical device (AIMD), the feedthrough filter assembly comprising:
a) an alumina insulator substrate assembly, comprising:
i) an alumina insulator body defining and separating a body fluid side from a device side;
ii) a via hole disposed through the alumina insulator body extending from the body fluid side to the device side;
iii) a conductive fill disposed within the via hole forming a filled via electrically conductive between the device side and the body fluid side;
iv) a first hermetic seal between the filled via and the alumina insulator body, the first hermetic seal having a having a leak rate no greater than 1×10 −7 std cc He/sec;
v) an insulator metallization disposed on an outer surface of the alumina insulator body;
b) a ferrule, comprising:
i) a conductive ferrule body defining a ferrule opening;
ii) a second hermetic seal between the insulator metallization of the alumina insulator body and the conductive ferrule body, wherein the second hermetic seal comprises a gold braze, and wherein the ferrule opening is hermetically sealed having a leak rate no greater than 1×10 −7 std cc He/sec;
c) a feedthrough filter capacitor disposed on the device side, the feedthrough filter capacitor comprising:
i) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the plates are disposed within a capacitor dielectric substrate;
ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the plates;
iii) an internal metallization disposed within the first passageway electrically connected to the at least one active electrode plate and in non-conductive relation with the at least one ground electrode plate;
iv) an external metallization disposed on an outside surface of the capacitor dielectric substrate and electrically connected to the at least one ground electrode plate and in non-conductive relation with the at least one active electrode plate;
d) a conductive leadwire having a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD, and wherein the distal leadwire end is disposed at least partially through the first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near the device side conductive fill; e) a first electrically conductive material forming at least a three-way electrical c

Assignees

• Greatbatch Ltd

Inventors

• Stevenson Robert A
• Marzano Thomas
• Seitz Keith W
• Frysz Christine A

Classifications

• A61N1/37512

  Pacemakers · CPC title

• H01R43/00

  Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28) · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/35

  Feed-through capacitors or anti-noise capacitors · CPC title

• Y10T156/1052

  with cutting, punching, tearing or severing · CPC title