Modular pressurized workstation

Patent metadata

Field	Value
Publication number	US-11901206-B2
Application number	US-202318104731-A
Country	US
Kind code	B2
Filing date	Feb 1, 2023
Priority date	Nov 28, 2017
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

First claim

What is claimed is:

1. A system, comprising:
a processing tool configured to process a semiconductor workpiece;
a first pressurized load port configured to receive the semiconductor workpiece from the processing tool, wherein an air pressure in the first pressurized load port is equalized with a set pressure level;
a second pressurized load port configured to receive the semiconductor workpiece from the first pressurized load port, wherein the second pressurized load port is set at the set pressure level when receiving the semiconductor workpiece from the first pressurized load port and thereafter set to an external air pressure; and
an inspection tool configured to receive the semiconductor workpiece from the second pressurized load port, wherein the inspection tool is configured to inspect the semiconductor workpiece for defects from processing by the processing tool.

2. The system of claim 1 , wherein the first and second pressurized load ports each comprise a chamber between a first door and a second door, wherein only one door is configured to be open at any time.

3. The system of claim 1 , wherein the set pressure level is less than a standard atmosphere (atm).

4. The system of claim 1 , wherein the first and second pressurized load ports protrude from a region outlined by a workstation body wall.

5. The system of claim 1 , wherein the first load port and the second load port each comprises a chamber that is at the set pressure level when a door between the chamber and the workstation body is open.

6. The system of claim 1 , further comprising a sorter at the set pressure level and configured to provide a buffering space for work in progress semiconductor workpieces.

7. The system of claim 1 , wherein the set pressure level is 10 −1 Torr to 10 −3 Torr.

8. A system, comprising:
first, second and third pressurized load ports each set at a set pressure level;
a workstation body maintained at the set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first, second and third load ports;
a first modular tool configured to process the semiconductor workpiece, wherein the first modular tool has only a single chamber interfaced with the first and second pressurized load ports, and wherein the first pressurized load port is used for a first application and the second pressurized load port is used for a second application different from the first application; and
a second modular tool configured to inspect the semiconductor workpiece processed by the first modular tool, wherein the second modular tool has only a single chamber interfaced with the first, second and third pressurized load ports.

9. The system of claim 8 , further comprising a fourth pressurized load port, wherein the third pressurized load port is used for a third application and the fourth pressurized load port is used for a fourth application different from the third application.

10. The system of claim 8 , further comprising a first transportation platform having a plurality of wheels extending from a bottom surface thereof and configured to transport the first modular tool to interface with the workstation body or disengage from the workstation body.

11. The system of claim 10 , further comprising a second transportation platform having a plurality wheels extending from a bottom surface thereof and configured to transport the second modular tool to interface with the workstation body or disengage from the workstation body.

12. The system of claim 9 , wherein the first, second, third and fourth pressurized load ports each comprise a chamber between a first door and a second door, wherein only one door is configured to be open at any time.

13. The system of claim 9 , further comprising a fifth pressurized load port interfaced with an external material handling system, the external material handling system at a second pressure level different than the set pressure level.

14. The system of claim 8 , further comprising a sorter set at the set pressure level and configured to provide a buffering space for work in progress semiconductor workpieces.

15. The method of claim 8 , wherein the set pressure level is less than a standard atmosphere (atm).

16. A system, comprising:
a workstation body maintained at a set pressure level;
first, second, third and fourth pressurized load ports each interfaced with the workstation body, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first, second, third and fourth pressurized load ports at the set pressure level;
a first modular tool configured to process the semiconductor workpiece, the first modular tool having only a single chamber interfaced with the first and second pressurized load ports, wherein the first pressurized load port is used for a first application and the second pressurized load port is used for a second application different from the first application; and
a second modular tool configured to receive and process the semiconductor workpiece from the first modular tool, the second modular tool having only a single chamber interfaced with the third and fourth pressurized load ports, wherein the third pressurized load port is used for a third application and the fourth pressurized load port is used for a fourth application different from the third application, wherein:
the first pressurized load port is configured to receive the semiconductor workpiece from the processing tool, wherein an air pressure in the first pressurized load port is equalized with a set pressure level; and
the second pressurized load port is configured to receive the semiconductor workpiece from the first pressurized load port, wherein the second pressurized load port is set at the set pressure level when receiving the semiconductor workpiece from the first pressurized load port and thereafter set to an external air pressure.

17. The system of claim 16 , wherein the first, second, third and fourth pressurized load ports each comprise a chamber between a first door and a second door, wherein only one door is configured to be open at any time.

18. The system of claim 16 , wherein the fourth pressurized load port is configured to interface with an external material handling system, the external material handling system at a second pressure level different than the set pressure level.

19. The system of claim 16 , wherein the set pressure level is less than a standard atmosphere (atm).

20. The system of claim 16 , wherein the first, second and third pressurized load ports protrude from a region outlined by a workstation body wall.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Huang Chun-Jung
• Hsu Yung-Lin
• Hsu Kuang Huan
• Chen Jeff
• Huang Steven
• Yang Yueh-Lun

Classifications

• H10P72/3216

  using a general scheme of a conveying path within a factory · CPC title

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• H10P72/32 Primary

  between different workstations · CPC title

• H10P72/0452

  characterised by the layout of the process chambers · CPC title

• H01L21/67703 Primary

  Electricity · mapped topic