Silicone dual cure resins for additive manufacturing

US11891485B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11891485-B2
Application numberUS-201615754135-A
CountryUS
Kind codeB2
Filing dateNov 4, 2016
Priority dateNov 5, 2015
Publication dateFeb 6, 2024
Grant dateFeb 6, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of forming a three-dimensional object comprised of a silicone polymer is carried out by: (a) providing a silicone dual cure resin; (b) forming a three-dimensional intermediate from that resin, where the intermediate has the shape of, or a shape to be imparted to, the three-dimensional object, and where the resin is solidified in that intermediate object by irradiating with light; and then (c) further reacting the three-dimensional intermediate to form the three-dimensional object. The silicone dual cure resin includes: (i) a light polymerizable first reactant; (ii) a photoinitiator; (iii) at least one additional reactant(s), and (iv) optionally a catalyst. At least one of the first reactant and the additional reactant(s) contains a siloxane linkage.

First claim

Opening claim text (preview).

We claim: 1. A method of forming a three-dimensional object comprised of a silicone polymer, said method comprising: (a) providing a silicone dual cure resin; wherein said silicone dual cure resin comprises: (i) a light polymerizable first reactant; (ii) a photoinitiator; (iii) a second reactant comprising at least one siloxane linkage, and (iv) optionally a catalyst; wherein said light polymerizable first reactant optionally contains at least one siloxane linkage; (b) forming a solid polymer scaffold by irradiating said light polymerizable first reactant with patterned actinic radiation or light to form a three-dimensional intermediate from said resin, where said intermediate has the shape of, or a shape to be imparted to, said three-dimensional object, and wherein said second reactant is carried within the polymer scaffold in unsoldified form, whereby said three-dimensional intermediate is fabricated in a layer-by-layer or layerless manner through multiple exposures of the patterned actinic radiation or light; then (c) further reacting said three-dimensional intermediate, said further reacting sufficient to form said three-dimensional object comprised of a silicone polymer from said three-dimensional intermediate, wherein said further reacting in step (c) is carried out by a method comprising contacting said intermediate to moisture. 2. The method of claim 1 , wherein said silicone dual cure resin comprises an MD resin, a DT resin, an MT resin, an MDT resin, a DTQ resin, an MTQ resin, an MDTQ resin, a DQ resin, an MQ resin, a DTQ resin, an MTQ resin, or an MDQ resin. 3. The method of claim 1 , wherein said light polymerizable first reactant contains an alkene or alkyne linkage. 4. The method of claim 1 , wherein said further reacting step comprises a silanol or alkoxy silane-based moisture-cure condensation reaction. 5. The method of claim 1 , wherein said further reacting step comprises a moisture-cure condensation reaction, and: (i) said second reactant contains a silanol (Si—OH) or alkoxy silane (Si—OR) functional group, and (ii) said silicone dual cure resin further comprises a base catalyst or an acid catalyst. 6. The method of claim 1 , wherein said forming step is carried out by additive manufacturing. 7. The method of claim 6 , wherein said forming step is carried out by bottom-up three-dimensional fabrication between a carrier and a transparent member having a build surface, the carrier and the build surface optionally defining a build region therebetween, and wherein after said forming step (b) and before said further reacting step (c), said intermediate is removed from the carrier. 8. The method of claim 6 , wherein said forming step is carried out by continuous liquid interface production (CLIP). 9. The method of claim 7 , wherein said method further comprises vertically reciprocating said carrier with respect to the build surface to enhance or speed refilling of the build region with the resin. 10. The method of claim 1 , wherein said three-dimensional object comprises a polymer blend, interpenetrating polymer network, semi-interpenetrating polymer network, or sequential interpenetrating polymer network. 11. The method of claim 1 , wherein said resin further comprises a moisture-cure condensation retarder. 12. The method of claim 1 , wherein said resin further comprises a stabilizer. 13. The method of claim 1 , wherein said resin further comprises an oxygen scavenger. 14. The method of claim 1 , wherein said light polymerizable first reactant comprises an acrylate functionalized siloxane and said second reactant comprises a silanol (Si—OH) or alkoxy silane (Si—OR) functional group, and said resin further comprises a base catalyst or an acid catalyst as an additional component.

Assignees

Inventors

Classifications

  • C08G77/442Primary

    containing vinyl polymer sequences · CPC title

  • characterised by the energy source therefor, e.g. by global irradiation combined with a mask · CPC title

  • Processes of additive manufacturing · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

  • Products made by additive manufacturing · CPC title

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Frequently asked questions

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What does patent US11891485B2 cover?
A method of forming a three-dimensional object comprised of a silicone polymer is carried out by: (a) providing a silicone dual cure resin; (b) forming a three-dimensional intermediate from that resin, where the intermediate has the shape of, or a shape to be imparted to, the three-dimensional object, and where the resin is solidified in that intermediate object by irradiating with light; and t…
Who is the assignee on this patent?
Carbon Inc
What technology area does this patent fall under?
Primary CPC classification C08G77/442. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 06 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).