Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-11887869-B2
Application number	US-202117467346-A
Country	US
Kind code	B2
Filing date	Sep 6, 2021
Priority date	Dec 13, 2017
Publication date	Jan 30, 2024
Grant date	Jan 30, 2024

Abstract

A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate holder configured to hold a substrate;
a first cleaning body configured to clean one surface of an upper surface and a lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith;
a first mover including a first arm configured to horizontally move the first cleaning body;
a second cleaning body configured to clean a remaining surface of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith;
a second mover including a second arm configured to horizontally move the second cleaning body;
a third cleaning body configured to clean a side end of the substrate held by the substrate holder by coming into contact therewith;
a housing configured to surround the first mover and the second mover; and

a controller configured to control an overall operation of the substrate processing apparatus,
wherein the controller is programmed to:
perform a both-surface cleaning processing in which the first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, from a position at a center of the substrate to a position overlapping the second cleaning body which is stopped at a position deviated from the center of the substrate, and subsequently moves both the first cleaning body and the second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and
perform a side end cleaning processing in which the third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.

2. The substrate processing apparatus of claim 1 , further comprising
a lower surface cleaning nozzle configured to supply a cleaning fluid to the lower surface of the substrate held by the holder.

3. The substrate processing apparatus of claim 2 , further comprising
an upper surface cleaning nozzle configured to supply the cleaning fluid to the upper surface of the substrate held by the holder,
wherein the controller is further programmed to, in the both-surface cleaning processing, supply the cleaning fluid from the upper surface cleaning nozzle and the lower surface cleaning nozzle, and stop the supplying of the cleaning fluid from the upper surface cleaning nozzle after the supplying of the cleaning fluid from the lower surface cleaning nozzle is stopped.

4. The substrate processing apparatus of claim 1 , wherein when the first cleaning body comes into contact with the substrate,
the first mover is configured to move up and down the first cleaning body,
the second mover is configured to move up and down the second cleaning body, and
the controller is programmed to control at least one of the first mover and the second mover such that a pressing force of the first cleaning body against the one surface and a pressing force of the second cleaning body against the remaining surface have a same magnitude in the both-surface cleaning processing.

Assignees

• Tokyo Electron Ltd

Inventors

• Mouri Nobuhiko
• Obaru Takanori
• Takiguchi Yasushi
• Kodama Teruhiko

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title