Two-part epoxy based composition

Patent metadata

Field	Value
Publication number	US-11866535-B2
Application number	US-202117153027-A
Country	US
Kind code	B2
Filing date	Jan 20, 2021
Priority date	Jul 27, 2018
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.

First claim

What is claimed is:

1. A two-part epoxy based composition comprising:
(a) a first part comprising at least one epoxy resin;
(b) a second part comprising:
(i) from 5 to 75% by weight of the second part of at least one epoxy resin curing agent; and
(ii) from 25 to 95% by weight of the second part of at least one acrylamide compound represented by the following general formula (1):

wherein R 1 , R 2 and R 3 are identical or different, and independently represent hydrogen atoms or optionally substituted univalent organic groups; and
wherein at least one of R 2 and R 3 is a hydrogen atom;

wherein a mixture of the first part and the second part can be cured at room temperature to produce a cured product of the two-part epoxy based composition.

2. The two-part epoxy based composition according to claim 1 , wherein the at least one epoxy resin comprises at least two epoxy groups per molecule.

3. The two-part epoxy based composition according to claim 1 , wherein the at least one epoxy resin curing agent is selected from at least one of polyamide, amine, imidazole and the derivatives thereof.

4. The two-part epoxy based composition according to claim 1 , wherein R 1 in the general formula (1) contains a tertiary amino group.

5. The two-part epoxy based composition according to claim 1 , wherein at least one of R 1 , R 2 and R 3 in the general formula (1) is a group represented by the following general formula (2),

wherein * represents a bonding position to the nitrogen atom in the acrylamide structure in the general formula (1); R 4 and R 5 are identical or different, and independently represent hydrogen atoms or optionally substituted univalent organic groups; and a is an integer from 1 to 20.

6. The two-part epoxy based composition according to claim 5 , wherein R 4 and R 5 in the general formula (2) are substituted C 1 to C 6 univalent organic groups.

7. The two-part epoxy based composition according to claim 1 , wherein the at least one acrylamide compound represented by the general formula (1) is present in an amount of from 30 to 90% by weight of the second part.

8. The two-part epoxy based composition according to claim 1 ,

wherein R 1 represents a hydrogen atom or an optionally substituted C 1 to C 10 univalent organic group; and
wherein one of R 2 and R 3 is a hydrogen atom, and the other one of R 2 and R 3 is a group represented by the following formula (2):

wherein * represents a bonding position to the nitrogen atom in the acrylamide structure in the general formula (1); R 4 and R 5 are identical or different, and independently optionally substituted C 1 to C 6 univalent organic groups; and a is an integer from 1 to 10.

9. The two-part epoxy based composition according to claim 1 , the weight ratio between the first part and the second part is from 20:1 to 1.

10. A cured product of the two-part epoxy based composition according claim 1 .

11. An article bonded by the two-part epoxy based composition according to claim 1 .

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Che Aifu
• Chen Chunfu
• Li Bin
• Wang Chao

Classifications

• C08F283/10 Primary

  on to polymers containing more than one epoxy radical per molecule {(C08F283/004 takes precedence)} · CPC title

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G59/1477

  containing nitrogen · CPC title

• C08G59/44

  Amides · CPC title

• C08G59/54

  Amino amides> · CPC title