Hermetic assembly and device including same

Patent metadata

Field	Value
Publication number	US-11865639-B2
Application number	US-202017118283-A
Country	US
Kind code	B2
Filing date	Dec 10, 2020
Priority date	Dec 13, 2019
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

First claim

What is claimed is:

1. A hermetic assembly comprising:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate by a laser bond; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

2. The assembly of claim 1 , further comprising a feedthrough disposed in the dielectric substrate.

3. The assembly of claim 2 , wherein the feedthrough comprises:
a via disposed between the first major surface and the second major surface of the dielectric substrate;
a conductive material disposed in the via; and
an external contact disposed over the via adjacent the first major surface of the dielectric substrate, wherein the external contact is electrically connected to the conductive material disposed in the via.

4. The assembly of claim 3 , wherein the external contact of the feedthrough is hermetically sealed to the first major surface of the dielectric substrate by a laser bond that surrounds the via.

5. The assembly of claim 1 , wherein the flange further comprises a major surface that contacts the welding portion of the patterned layer.

6. The assembly of claim 5 , wherein the major surface of the flange is substantially parallel to the first major surface of the dielectric substrate.

7. The assembly of claim 1 , further comprising an electronic component disposed adjacent to at least one of the first major surface or the second major surface of the dielectric substrate, wherein one or more test points are disposed on a surface of the electronic component.

8. The assembly of claim 1 , wherein the ferrule further comprises a tab extending from the body and adapted to connect the ferrule to a header.

9. A hermetically-sealed package comprising a housing and a hermetic assembly that forms a part of the housing, wherein the hermetic assembly comprises:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate by a laser bond; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate;
wherein an edge of the body of the ferrule is connected to an edge of the housing.

10. The package of claim 9 , further comprising a header connected to a second edge of the body of the ferrule and electrically connected to the hermetic assembly.

11. The package of claim 9 , further comprising a second housing connected to a second edge of the body of the ferrule, wherein the second housing comprises an external contact adapted to provide an electrical signal to tissue of a patient.

12. The package of claim 9 , wherein the ferrule further comprises a slot disposed in the body of the ferrule, wherein the slot is adapted to form a vent with the edge of the housing and a sidewall of the housing.

13. The package of claim 9 , wherein the hermetic assembly further comprises a feedthrough disposed in the dielectric substrate.

14. A method comprising:
laser bonding a patterned layer to a first major surface of a dielectric substrate; and
welding a flange of a ferrule to a welding portion of the patterned layer such that the welding portion is between the flange and the first major surface of the dielectric substrate and the ferrule is hermetically sealed to the dielectric substrate, wherein the flange extends from a body of the ferrule.

15. The method of claim 14 , further comprising disposing a power source within a recess of a housing before welding the flange of the ferrule to the welding portion of the patterned layer.

16. The method of claim 14 , further comprising connecting an edge of the body of the ferrule to an edge of a housing.

17. The method of claim 16 , further comprising connecting a second edge of the body of the ferrule to an edge of a second housing.

18. The method of claim 17 , wherein the second housing comprises a header that is electrically connected to a feedthrough disposed in the dielectric substrate.

19. The method of claim 14 , further comprising forming a feedthrough in the dielectric substrate prior to laser bonding the patterned layer to the first major surface of the dielectric substrate, wherein forming the feedthrough comprises:
forming a via between the first major surface and the second major surface of the dielectric substrate;
disposing conductive material within the via; and
forming an external contact over the via such that the external contact is electrically connected to the conductive material disposed within the via, wherein the external contact is a portion of the patterned layer.

20. The method of claim 19 , wherein the external contact of the feedthrough is formed by the welding portion of the patterned layer such that the feedthrough is electrically connected to the flange of the ferrule.

Assignees

• Medtronic Inc

Inventors

• Ruben David A
• Fenner Andreas
• Ries Andrew J
• Munoz Robert A
• Kinsey Christopher T
• Henschel Mark E

Classifications

• B23K26/206 Primary

  Laser sealing · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• A61N1/3968

  Constructional arrangements, e.g. casings (A61N1/375 takes precedence) · CPC title

• B23K26/32

  taking account of the properties of the material involved · CPC title

• H05K5/066

  sealed by fusion of the joining parts without bringing material; sealed by brazing · CPC title