Recycled glass and glass-ceramic carrier sustrates

Patent metadata

Field	Value
Publication number	US-11823967-B2
Application number	US-202017100102-A
Country	US
Kind code	B2
Filing date	Nov 20, 2020
Priority date	Nov 21, 2019
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A glass or glass-ceramic carrier substrate, the substrate having undergone at least one complete cycle of a semiconductor fabrication process and having also undergone a reclamation process following the end of the semiconductor fabrication process; the glass or glass-ceramic carrier substrate comprising at least one of the following properties: (i) a coefficient of thermal expansion of less than 13 ppm/° C.; (ii) a Young's Modulus of 70 GPa to 150 GPa; (iii) an IR transmission of greater than 80% at a wavelength of 1064 nm; (iv) a UV transmission of greater than 20% at a wavelength of 255 nm to 360 nm; (v) a thickness tolerance within the same range as the thickness tolerance of the carrier substrate before undergoing at least one complete cycle of the semiconductor fabrication process; (vi) a total thickness variation of less than 2.5 μm; (vii) a failure strength of greater than 80 MPa using a 4-point-bending test; (viii) a pre-shape of 50 μm to 300 μm.

First claim

What is claimed is:

1. A glass or glass-ceramic carrier substrate, the carrier substrate having undergone at least one complete cycle of a semiconductor fabrication process and having also undergone a reclamation process following the end of the semiconductor fabrication process, the reclamation process including strengthening the glass or glass-ceramic carrier substrate; the glass or glass-ceramic carrier substrate comprising the following properties:
a thickness tolerance of an original thickness of the carrier substrate is ±50 μm;
a total thickness variation of less than 2.5 μm; and
a failure strength of greater than 80 MPa according to a 4-point bending protocol test, and
wherein the glass or glass-ceramic carrier substrate includes at least one of the following properties:
(i) a coefficient of thermal expansion of less than 13 ppm/° C. at a temperature of 0 degrees Celsius to 300 degrees Celsius;
(ii) a Young's Modulus of 70 GPa to 150 GPa;
(iii) an IR transmission of greater than 80% at a wavelength of 1064 nm;
(iv) a UV transmission of greater than 20% at a wavelength of 255 nm to 360 nm; and
(v) a pre-shape of 50 μm to 300 μm.

2. The carrier substrate of claim 1 , wherein the carrier substrate is a semiconductor wafer, a flat panel display, or a solar panel.

3. The carrier substrate of claim 1 , wherein the carrier substrate comprises one or more surfaces with a protective coating.

4. The carrier substrate of claim 1 , wherein the coefficient of thermal expansion of the carrier substrate is 4 ppm ° C. to 12 ppm/° C.

5. The carrier substrate of claim 1 , wherein the coefficient of thermal expansion of the carrier substrate is less than 11 ppm/° C.

6. The carrier substrate of claim 1 , wherein the coefficient of thermal expansion of the carrier substrate is 5 ppm/° C. to 10 ppm/° C.

7. The carrier substrate of claim 1 , wherein the Young's Modulus of the carrier substrate is 80 GPa to 100 GPa.

8. The carrier substrate of claim 1 , wherein the Young's Modulus of the carrier substrate is 90 GPa to 150 GPa.

9. The carrier substrate of claim 1 , wherein the thickness tolerance of the original thickness of the carrier substrate is ±5 μm.

10. The carrier substrate of claim 9 , wherein the total thickness variation of the carrier substrate is less than 2 μm.

11. The carrier substrate of claim 9 , wherein the total thickness variation of the carrier substrate is less than 1 μm.

12. The carrier substrate of claim 1 , wherein the carrier substrate comprises at least two of the properties (i)-(v).

13. The carrier substrate of claim 1 , wherein the carrier substrate comprises at least three of the properties (i)-(v).

14. The carrier substrate of claim 1 , wherein the carrier substrate comprises at least four of the properties (i)-(v).

15. The carrier substrate of claim 1 , wherein the carrier substrate comprises all the properties (i)-(v).

Assignees

• Corning Inc

Inventors

• Bellman Robert Alan
• Dutta Indrajit
• Hsieh Yi-Cheng
• Ono Toshihiko
• Smith Nicholas James

Classifications

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W70/692 Primary

  Ceramics or glasses · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H01L23/15 Primary

  Electricity · mapped topic

• C03C15/00

  Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title