Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/15 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,468 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 56 |
| 2016 | 56 |
| 2017 | 67 |
| 2018 | 110 |
| 2019 | 140 |
| 2020 | 155 |
| 2021 | 143 |
| 2022 | 114 |
| 2023 | 128 |
| 2024 | 209 |
| 2025 | 242 |
| 2026 | 48 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Glass-integrated inductors in integrated circuit packages
US-2024332100-A1 · Oct 3, 2024 · US
Dual sided embedded passives via panel level thermal compression bonding
US-2024113000-A1 · Apr 4, 2024 · US
Interposer with lattice construction and embedded conductive metal structures
US-2016372337-A1 · Dec 22, 2016 · US
Multilayer ceramic electronic device and method for manufacturing the same
US-9226400-B2 · Dec 29, 2015 · US
Circuit arrangement for a thermally conductive chip assembly and a manufacturing method
US-9224666-B2 · Dec 29, 2015 · US
Chip arrangement, and method for forming a chip arrangement
US-9219031-B2 · Dec 22, 2015 · US
Wiring substrate, semiconductor device, and method of manufacturing wiring substrate
US-9220167-B2 · Dec 22, 2015 · US
Electronic component and method of fabricating the same
US-9214445-B2 · Dec 15, 2015 · US
Via-holed ceramic substrate, metallized via-holed ceramic substrate, and method for manufacturing the same
US-9215801-B2 · Dec 15, 2015 · US
Multilayer substrate
US-9204545-B2 · Dec 1, 2015 · US
Wiring substrate, method for manufacturing wiring substrate, and semiconductor package
US-9202781-B2 · Dec 1, 2015 · US
Diplexer design using through glass via technology
US-9203373-B2 · Dec 1, 2015 · US
Power semiconductor module having pattern laminated region
US-9196604-B2 · Nov 24, 2015 · US
Wiring board, wiring board with lead, and electronic device
US-2015334834-A1 · Nov 19, 2015 · US
Metal-insulator-metal capacitors on glass substrates
US-9190208-B2 · Nov 17, 2015 · US
Aluminum nitride substrate for circuit board and production method thereof
US-9190189-B2 · Nov 17, 2015 · US
Glass ceramic body, substrate for mounting light emitting element, and light emitting device
US-9175834-B2 · Nov 3, 2015 · US
Apparatus related to an improved package including a semiconductor die
US-9177925-B2 · Nov 3, 2015 · US
Die assembly on thin dielectric sheet
US-9177831-B2 · Nov 3, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/15?
- CPC H01L23/15 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/15 (Electricity)?
- Our database includes 1,468 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/15 growing?
- Publication counts under this code: 209 in 2024 vs 242 in 2025 (latest complete years).