Wafer assembly for MEMS fabrication

Patent metadata

Field	Value
Publication number	US-11823943-B2
Application number	US-202217739937-A
Country	US
Kind code	B2
Filing date	May 9, 2022
Priority date	Jun 3, 2019
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.

First claim

The invention claimed is:

1. A wafer assembly for use in a MEMS fabrication process, the wafer assembly comprising:
a MEMS wafer comprising MEMS inkjet devices having inkjet nozzles on a frontside and an opposite backside;
a peel tape releasably attached to the frontside of the wafer, the peel tape directly contacting the inkjet nozzles;
a first wafer bonding tape attached to the peel tape; and
a first carrier substrate releasably attached to the first wafer bonding tape,

wherein:
the first wafer bonding tape comprises silicon;
the peel tape is absent any silicon; and
the resulting MEMS inkjet devices are absent any silica contaminants after removal of the peel tape and oxidative ashing.

2. The wafer assembly of claim 1 , further comprising:
a second wafer bonding tape attached to the backside of the wafer; and
a second carrier substrate releasably attached to the second wafer bonding tape.

3. The wafer assembly of claim 2 , wherein the second wafer bonding tape is different than the first wafer bonding tape.

4. The wafer assembly of claim 2 , wherein the first and second wafer bonding tapes are selected from the group consisting of: UV-release tape and thermal-release tape.

Assignees

• Memjet Technology Ltd

Inventors

• Arnal Nicolas
• Quimpo Troy Pasiola
• North Angus

Classifications

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/7442

  Separation by peeling · CPC title

• H01L21/6836 Primary

  Electricity · mapped topic

• B41J2/16 Primary

  Production of nozzles · CPC title

• B41J2/1635

  dividing the wafer into individual chips · CPC title