Substrate treating apparatus and method for controlling temperature of ferrite core

Patent metadata

Field	Value
Publication number	US-11823874-B2
Application number	US-202117323250-A
Country	US
Kind code	B2
Filing date	May 18, 2021
Priority date	May 19, 2020
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

Disclosed is a substrate treating apparatus, which includes a chamber having a space for treating a substrate in an interior thereof, a substrate support assembly including a support plate situated in the chamber and which supports the substrate, a gas supply unit which supplies a gas into the interior of the chamber, a plasma generating unit which excites the gas in in the interior of the chamber into a plasma state, and a substrate temperature control unit which controls a temperature of the substrate, and the substrate temperature control unit includes a plurality of heaters installed in different areas of the support plate, a power supply part which supplies electric power to the plurality of heaters, a ferrite core which interrupts a low-frequency signal introduced to the power supply part, and a plurality of air cores which interrupts a high-frequency signal introduced into the power supply part.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a chamber having a space for treating a substrate in an interior thereof;
a substrate support assembly including a support plate situated in the chamber and configured to support the substrate;
a gas supply unit configured to supply a gas into the interior of the chamber;
a plasma generating unit configured to excite the gas in in the interior of the chamber into a plasma state; and
a substrate temperature control unit configured to control a temperature of the substrate,
wherein the substrate temperature control unit includes:
a plurality of heaters installed in different areas of the support plate;
a power supply part configured to supply electric power to the plurality of heaters;
a ferrite core configured to interrupt a low-frequency signal introduced to the power supply part; and
a plurality of air cores configured to interrupt a high-frequency signal introduced into the power supply part.

2. The substrate treating apparatus of claim 1 , wherein the ferrite core is provided between the plurality of air cores and the power supply part and a length of the ferrite core is larger than those of the plurality of air cores.

3. The substrate treating apparatus of claim 2 , wherein one ferrite core is provided.

4. The substrate treating apparatus of claim 1 , wherein the ferrite core comprises a coil having an inductance of 100 μH to 150 μH.

5. The substrate treating apparatus of claim 1 , wherein the substrate temperature control unit further includes:
a ferrite core temperature measuring part configured to measure a temperature of the ferrite core.

6. The substrate treating apparatus of claim 5 , wherein the substrate temperature control unit further includes:
a ferrite core cooling part configured to cool the ferrite core; and
a ferrite core temperature control part configured to control the ferrite core cooling part according to the temperature of the ferrite core.

7. The substrate treating apparatus of claim 6 , wherein the ferrite core cooling part includes a plurality of cooling fans installed around the ferrite core.

8. The substrate treating apparatus of claim 6 , wherein the ferrite core temperature control part controls the ferrite core cooling part such that the temperature of the ferrite core is maintained in a range of 50 to 100 degrees Celsius.

9. A substrate treating apparatus comprising:
a chamber having a space for treating a substrate in an interior thereof;
a substrate support assembly including a support plate situated in the chamber and configured to support the substrate;
a gas supply unit configured to supply a gas into the interior of the chamber;
a plasma generating unit configured to excite the gas in in the interior of the chamber into a plasma state; and
a substrate temperature control unit configured to control a temperature of the substrate,
wherein the substrate temperature control unit includes:
a plurality of heaters installed in different areas of the support plate;
a plurality of power supply parts configured to supply electric power to the plurality of heaters, respectively; and
a filter circuit connected between the plurality of heaters and the plurality of power supply parts, and
wherein the filter circuit includes:
a first filter configured to perform filtering by using a plurality of air cores connected to the plurality of heaters, respectively; and
a second filter connected between the first filter and the plurality of power supply parts and configured to perform filtering by using one ferrite core.

10. The substrate treating apparatus of claim 9 , wherein the first filter interrupts a high-frequency signal introduced into the power supply part, and
wherein the second filter interrupts a low-frequency signal introduced into the power supply part.

11. The substrate treating apparatus of claim 9 , wherein the ferrite core is provided between the plurality of air cores and the power supply part and a length of the ferrite core is larger than those of the plurality of air cores.

12. The substrate treating apparatus of claim 11 , wherein one ferrite core is provided.

13. The substrate treating apparatus of claim 9 , wherein the substrate temperature control unit further includes:
a ferrite core temperature measuring part configured to measure a temperature of the ferrite core.

14. The substrate treating apparatus of claim 13 , wherein the substrate temperature control unit further includes:
a ferrite core cooling part configured to cool the ferrite core; and
a ferrite core temperature control part configured to control the ferrite core cooling part according to the temperature of the ferrite core.

15. The substrate treating apparatus of claim 14 , wherein the ferrite core cooling part includes a plurality of cooling fans installed around the ferrite core.

16. The substrate treating apparatus of claim 14 , wherein the ferrite core temperature control part controls the ferrite core cooling part such that the temperature of the ferrite core is maintained in a range of 50 to 100 degrees Celsius.

Assignees

• Semes Co Ltd

Inventors

• Galstyan Ogsen
• Lee Junpyo
• Park Goon Ho
• Kim Hyun-Jin
• Kim Young-Bin
• An Jong-Hwan

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H01J37/32724 Primary

  Temperature · CPC title