Spray system for slurry reduction during chemical mechanical polishing (cmp)

Patent metadata

Field	Value
Publication number	US-11819976-B2
Application number	US-202117359255-A
Country	US
Kind code	B2
Filing date	Jun 25, 2021
Priority date	Jun 25, 2021
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP polishing method including urging a substrate against a surface of a pad of a polishing system using a carrier assembly. A fluid is dispensed onto the pad from a fluid delivery assembly at a variable flow rate and a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle. The frequency refers to a number of pulses of the fluid at the first flow rate per rotation of the pad. The term duty cycle refers to a percentage of the pad exposed to fluid per rotation of the pad. The carrier assembly is translated across a surface of the pad while rotating the carrier assembly about a rotational axis.

First claim

What is claimed is:

1. A method of polishing a substrate, comprising:
urging a substrate against a surface of a pad of a polishing system using a carrier assembly;
dispensing fluid from one or more nozzles to one or more radial positions above the pad from a fluid delivery assembly at a variable flow rate, wherein a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle, wherein
the frequency is a number of pulses of the fluid at the first flow rate per rotation of the pad and the duty cycle is a percentage of the pad exposed to fluid per rotation of the pad,
dispensing the fluid further comprises:
setting a duty cycle to 100% for the at least one nozzle for at least one pad rotation,
reducing the duty cycle for the at least one nozzle, and
setting a frequency and at least one flow rate for at least one nozzle; and

translating the carrier assembly across a surface of the pad while rotating the carrier assembly about a rotational axis.

2. The method of claim 1 , further comprising controlling each dispensing nozzle to dispense at corresponding variable flow rates, wherein controlling each variable flow rate comprises turning on and off each nozzle at corresponding frequency and duty cycle.

3. The method of claim 1 , wherein the fluid is dispensed on the pad proximate to a leading edge of a translational path of the carrier assembly.

4. The method of claim 1 , wherein dispensing the fluid further comprises dispensing the fluid from a single fluid supply vessel, wherein the fluid is split to each of the nozzles.

5. The method of claim 1 , wherein each nozzle dispenses at corresponding zones of the pad, wherein a spray profile of fluid dispensed on each zone is controlled by adjusting a fluid flow ratio across the nozzles, wherein the fluid flow ratio is determined based on the variable flow rate of each nozzle relative to one another.

6. The method of claim 1 , wherein a duty cycle of each nozzle is about 25% to about 80%.

7. The method of claim 1 , wherein dispensing the fluid comprises dispensing fluid from each nozzle at corresponding fan jets, wherein each fan jet comprises edge to edge angles, wherein each angle is about 15 degrees to about 110 degrees.

8. The method of claim 1 , wherein dispensing the fluid further comprises dispensing different fluids from different fluid supply vessels.

9. The method of claim 1 , wherein the fluid delivery assembly further comprises an arm and a plate coupled to the arm, the plate comprises the one or more nozzles and one or more valves coupled to the one or more nozzles.

10. The method of claim 9 , wherein the each of the one or more valves corresponds to one of the one or more nozzles.

11. The method of claim 9 , further comprising an actuator coupled to the arm and configured to translate the fluid delivery assembly between a retracted and an extended position.

12. The method of claim 1 , wherein the dispensing of the fluid further comprises dispensing the fluid on the pad a distance from an edge of the carrier assembly.

13. The method of claim 1 , wherein the dispensing of the fluid further comprises dispensing a fluid that has a temperature less than the temperature of the pad.

14. The method of claim 1 , wherein the one or more nozzles comprise a first nozzle configured to dispense a fluid to an inward zone and a second nozzle configured to dispense a fluid to an outward zone, the inward zone and the outward zone are different radial zones along the pad radius.

15. The method of claim 1 , wherein the fluid delivery assembly further comprises an arm and a plate coupled to the arm, the plate comprises the one or more nozzles and one or more valves coupled to the one or more nozzles, the one or more nozzles are fan jet nozzles coupled to the plate and configured to dispense the fluid having a flat fan jet shape, wherein the fluid is pressurized.

16. The method of claim 1 , wherein the fluid delivery assembly comprises at least two nozzles, each nozzle comprising corresponding outlet sizes, wherein each nozzle outlet size is different from at least one other nozzle.

17. A method of polishing a substrate, comprising:
urging a substrate against a surface of a pad of a polishing system using a carrier assembly;
dispensing fluid from one or more nozzles at corresponding radial positions above the pad from a fluid delivery assembly at a variable flow rate, wherein a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle, wherein
the frequency is a number of pulses of the fluid at the first flow rate per rotation of the pad,
the duty cycle is a percentage of the pad exposed to fluid per rotation of the pad,
the frequency of each nozzle is about 10 Hz to about 40 Hz, the duty cycle of about 25% to about 80%; and

translating the carrier assembly across a surface of the pad while rotating the carrier assembly about a rotational axis.

18. The method of claim 16 , wherein each of the one or more nozzles are coupled to a corresponding valve.

19. A method of polishing a substrate, comprising:
urging a substrate against a surface of a pad of a polishing system using a carrier assembly;
dispensing fluid at corresponding radial positions above the pad from a fluid delivery assembly at a variable flow rate, the fluid delivery assembly comprising:
an arm;
a plate coupled to the arm;
one or more nozzles, each nozzle coupled to a portion of the plate and configured to dispense a pressurized fluid having a flat fan jet shape to one or more zones on the pad; and
one or more valves coupled to a corresponding nozzle of the one more nozzles, wherein a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle, wherein the frequency is a number of pulses of the fluid at the first flow rate per rotation of the pad and the duty cycle is a percentage of the pad exposed to fluid per rotation of the pad, the frequency of each nozzle is about 10 Hz to about 40 Hz, the duty cycle of about 25% to about 80%; and

translating the carrier assembly across a surface of the pad while rotating the carrier assembly about a rotational axis.

Assignees

• Applied Materials Inc

Inventors

• Chou Chih Chung
• Iyer Anand Nilakantan
• Mikhaylichenko Ekaterina
• Lee Christopher Heung-Gyun
• Rondum Erik
• Cheung Tiffany Yu-Nung
• Chang Shou-Sung

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• B24B57/02 Primary

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B37/11

  Lapping tools · CPC title

• B24B37/042 Primary

  operating processes therefor · CPC title

• H01L21/30625

  Electricity · mapped topic