Method for processing electronic/electrical device component scraps

US11819885B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11819885-B2
Application numberUS-202017598949-A
CountryUS
Kind codeB2
Filing dateMar 27, 2020
Priority dateMar 29, 2019
Publication dateNov 21, 2023
Grant dateNov 21, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for processing electronic and electrical device component scraps, comprising separating a substrate with lead wires contained in the electronic and electrical device component scraps by performing a wind power sorting at a wind velocity between 15 to 20 m/s by using a wind power sorting device which comprises a guide portion provided therein and being arranged such that an airflow which is brought into contact with the substrate with lead wires in a perpendicular direction to a lower surface of the substrate with lead wires, before sorting the electronic and electrical device component scraps by magnetic sorting. 2. The method for processing electronic and electrical device component scraps according to claim 1 , wherein the substrate with lead wires contained in the electronic and electrical device component scraps is separated so that the substrate with lead wires contained in objects to be processed supplied to the magnetic sorting is 10% by mass or less. 3. The method for processing electronic and electrical device component scraps according to claim 1 , wherein a wind velocity of the wind power sorting is 10 to 20% higher than a wind velocity at which plastics can be separated. 4. The method for processing electronic and electrical device component scraps according to claim 1 , wherein the electronic and electrical device component scraps before being subjected to the magnetic sorting are crushed using a shear type crusher or a hammer type crusher. 5. The method for processing electronic and electrical device component scraps according to claim 1 , further comprising performing eddy current sorting after the magnetic sorting.

Assignees

Inventors

Classifications

  • B07B9/00Primary

    Combinations of apparatus for screening or sifting or for separating solids from solids using gas currents; General arrangement of plant, e.g. flow sheets · CPC title

  • with material carried by oscillating fields; with material carried by travelling fields, e.g. generated by stationary magnetic coils; Eddy-current separators, e.g. sliding ramp · CPC title

  • while the mixtures are supported by sieves, screens, or like mechanical elements · CPC title

  • Shredding, crushing or cutting · CPC title

  • Magnetic separation of bulk or dry particles in mixtures · CPC title

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What does patent US11819885B2 cover?
Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the elec…
Who is the assignee on this patent?
Jx Nippon Mining & Metals Corp, Jx Metals Corp
What technology area does this patent fall under?
Primary CPC classification B07B9/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).