Elastic wave device

Patent metadata

Field	Value
Publication number	US-11817847-B2
Application number	US-201816152591-A
Country	US
Kind code	B2
Filing date	Oct 5, 2018
Priority date	Apr 28, 2016
Publication date	Nov 14, 2023
Grant date	Nov 14, 2023

Abstract

An elastic wave device includes a piezoelectric substrate, an interdigital transducer electrode on the piezoelectric substrate, a support on the piezoelectric substrate, including a cavity, and surrounding the interdigital transducer electrode at the cavity, a cover covering the cavity and provided on the support, and a via hole electrode penetrating the cover and the support. The via hole electrode includes a projection portion projecting outward from a side surface portion when seen in a plan view. The projection portion is located within the cover.

First claim

What is claimed is:

1. An elastic wave device comprising:
a piezoelectric substrate;
an interdigital transducer electrode provided on the piezoelectric substrate;
a support provided on the piezoelectric substrate, including a cavity, and surrounding the interdigital transducer electrode at the cavity;
a cover covering the cavity and provided on the support; and
a via hole electrode penetrating the cover and the support and including a first end portion located at a piezoelectric substrate side, a second end portion located at a side opposite to the piezoelectric substrate side, and a side surface portion connecting an outer edge of the first end portion and an outer edge of the second end portion; wherein
the via hole electrode includes a projection portion projecting outward from the side surface portion when seen in a plan view;
the projection portion is located within the cover;
the projection portion includes a first projection surface and a second projection surface located at an end portion side with respect to the first projection surface;
the first projection surface and the second projection surface extend in a direction crossing a direction in which a via hole electrode extends;
the cover includes an adhesive layer bonded to the support and a protective layer provided on the adhesive layer;
the first projection surface is in contact with a surface at an adhesive layer side of the protective layer;
the second projection surface is in contact with a surface at the adhesive layer side of the support; and
when a direction traversing the via hole electrode is defined as a width direction, the side surface portion of the via hole electrode is inclined such that the via hole electrode is widened from the second projection surface to the first projection surface.

2. The elastic wave device according to claim 1 , wherein the first projection surface and the second projection surface extend in a direction orthogonal or substantially orthogonal to the direction in which the via hole electrode extends.

3. The elastic wave device according to claim 1 , wherein the adhesive layer has an elastic modulus lower than that of the protective layer.

4. The elastic wave device according to claim 1 , wherein the second end portion located at the side opposite to the piezoelectric substrate side of the via hole electrode has a planar area larger than a cross-sectional area of a portion of the via hole electrode on which the second projection surface is located.

5. The elastic wave device according to claim 1 , wherein the adhesive layer is made of an epoxy resin, and the protective layer is made of polyimide.

6. The elastic wave device according to claim 1 , further comprising:
an electrode land provided on the piezoelectric substrate; wherein
the support covers the electrode land.

7. The elastic wave device according to claim 6 , wherein the first end portion of the via hole electrode is connected to the electrode land.

8. The elastic wave device according to claim 1 , wherein the piezoelectric substrate, the support, and the cover define a hollow space in which the interdigital transducer electrode is disposed.

9. The elastic wave device according to claim 1 , wherein the support is made of resin.

10. The elastic wave device according to claim 1 , wherein a solder bump is joined to the second end portion of the via hole electrode.

11. The elastic wave device according to claim 1 , wherein the via hole electrode has a circular or substantially circular planar shape.

Assignees

• Murata Manufacturing Co

Inventors

• Fukuda Daisuke

Classifications

• H03H9/1092 Primary

  the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's · CPC title

• H03H9/0585

  consisting of an adhesive layer · CPC title

• H03H9/1071 Primary

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title

• H03H9/25

  Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)} · CPC title

• H03H9/059

  consisting of mounting pads or bumps · CPC title