Acoustic wave device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11437563-B2
Application number	US-201815972499-A
Country	US
Kind code	B2
Filing date	May 7, 2018
Priority date	Jul 17, 2017
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

An acoustic wave device includes an acoustic wave generator, a support portion, a protective member, and at least one element embedded in the protective member. The acoustic wave generator is disposed on a surface of a substrate. The support portion is disposed on the substrate along a circumference of the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by an interval.

First claim

What is claimed is:

1. An acoustic wave device comprising:
an acoustic wave generator disposed on a surface of a substrate;
a support portion disposed on the substrate along a circumference of the acoustic wave generator so that the support portion does not face a surface of the acoustic wave generator facing away from the substrate;
a protective member coupled to the support portion so that the protective member directly faces the surface of the acoustic wave generator facing away from the substrate and is spaced apart from the surface of the acoustic wave generator facing away from the substrate by an interval; and
at least one element embedded in the protective member.

2. The acoustic wave device of claim 1 , wherein the protective member comprises a substrate covering the surface of the acoustic wave generator facing away from the substrate.

3. The acoustic wave device of claim 1 , wherein the protective member comprises an insulating member, and the at least one element comprises an inductor pattern embedded in the insulating member.

4. The acoustic wave device of claim 3 , further comprising a connection conductor penetrating through the support portion and the protective member,
wherein the inductor pattern is electrically connected to the acoustic wave generator through the connection conductor.

5. The acoustic wave device of claim 4 , wherein the connection conductor comprises one end connected to the substrate and another end coupled to a connection terminal.

6. The acoustic wave device of claim 1 , further comprising:
a plurality of connection terminals disposed on an outer surface of the protective member and electrically connecting the substrate and a main board to each other; and
at least one supporting terminal disposed between the main board and the protective member to support the protective member.

7. The acoustic wave device of claim 6 , wherein the supporting terminal and the connection terminals are made of a same material, and the supporting terminal and the connection terminals are coupled to the main board.

8. The acoustic wave device of claim 6 , wherein the supporting terminal is a dummy terminal that is not electrically connected to the substrate.

9. The acoustic wave device of claim 6 , wherein the supporting terminal is disposed in a region corresponding to a region in which the acoustic wave generator is formed.

10. The acoustic wave device of claim 1 , further comprising an airtight film disposed along surfaces of the protective member and the support portion, and configured to prevent either one or both of moisture and foreign materials from entering the acoustic wave generator.

11. The acoustic wave device of claim 10 , wherein the airtight film is made of an inorganic insulating film or a thin film.

12. An acoustic wave device comprising:
an acoustic wave generator disposed on a surface of a substrate;
a support portion disposed on the substrate along a circumference of the acoustic wave generator so that the support portion does not face a surface of the acoustic wave generator facing away from the substrate;
a first insulating layer coupled to the support portion so that the first insulating layer directly faces the surface of the acoustic wave generator facing away from the substrate and is spaced apart from the surface of the acoustic wave generator facing away from the substrate;
a first element embedded in the first insulating layer;
a second insulating layer disposed on the first insulating layer; and
a second element embedded in the second insulating layer.

13. The acoustic wave device of claim 12 , wherein either one or both of the first element and the second element comprises an inductor pattern.

14. The acoustic wave device of claim 13 , further comprising a connection conductor penetrating through the support portion, the first insulating layer, and the second insulating layer,
wherein the inductor pattern is electrically connected to the acoustic wave generator through the connection conductor.

15. The acoustic wave device of claim 14 , wherein the connection conductor comprises one end connected to the substrate and another end coupled to a connection terminal.

Assignees

• Samsung Electro Mech

Inventors

• Park Seung Wook
• Jung Jae Hyun
• Na Seong Hun

Classifications

• H03H9/1014

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title

• H03H9/171 Primary

  implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type · CPC title

• H03H9/0557 Primary

  the other elements being buried in the substrate · CPC title

• H03H9/1071

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title

• H03H9/64

  using surface acoustic waves · CPC title