Protection of aluminum process chamber components

Patent metadata

Field	Value
Publication number	US-11810766-B2
Application number	US-201916401871-A
Country	US
Kind code	B2
Filing date	May 2, 2019
Priority date	Jul 5, 2018
Publication date	Nov 7, 2023
Grant date	Nov 7, 2023

Abstract

Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.

First claim

What is claimed is:

1. A coated chamber component comprising:
a chamber component configured to be used in a processing volume of a chamber, the chamber component comprising an aluminum alloy; and
a multilayer coating having a thickness of 250 microns to 600 microns, comprising:
a first layer comprising titanium nitride disposed on and in contact with the chamber component; and
a second layer comprising tungsten nitride disposed on and in contact with the first layer, wherein a ratio of thickness of the first layer to thickness of the second layer is 1:1 to 1:3, wherein the second layer has an internal tensile stress, wherein the first layer has an internal compressive stress, and wherein the chamber component has an internal tensile stress.

2. The coated chamber component of claim 1 , wherein the first layer further comprises aluminum (Al).

3. The coated chamber component of claim 1 , wherein the first layer has a volumetric porosity from 1% to 20%.

4. The coated chamber component of claim 1 , wherein the chamber component has a thickness from 2000 microns to 5000 microns thick.

5. The coated chamber component of claim 1 , wherein the first layer is from 100 microns to 150 microns thick.

6. The coated chamber component of claim 1 , wherein the second layer is from 250 microns to 320 microns thick.

7. The coated chamber component of claim 1 , wherein the first layer comprises a residual stress from about −900 MPa to about −1100 MPa.

8. The coated chamber component of claim 1 , wherein the second layer comprises a residual stress from about −400 MPa to about −600 MPa.

9. The coated chamber component of claim 1 , wherein the first layer is from a thickness of 50 microns to 200 microns.

10. The coated chamber component of claim 1 , wherein the second layer a thickness of 200 microns to 400 microns.

11. The coated chamber component of claim 1 , wherein the coated chamber component is a chamber wall liner, a substrate support pedestal, or a showerhead.

12. The coated chamber component of claim 1 , wherein the second layer of the multilayer coating comprises a residual stress of 15% to 60% less than the second layer if it were disposed directly on the chamber component.

13. A method of forming a coating, comprising:
forming a multilayer coating on a chamber component configured to be used in a processing volume of a chamber, the chamber component comprising an aluminum alloy, the multilayer coating having a thickness of 250 microns to 600 microns, the forming of the multilayer coating comprising:
forming a first layer disposed on and in contact with the chamber component, comprising titanium nitride (TiN); and
forming a second layer disposed on and in contact with the first layer comprising tungsten nitride (W 2 N), wherein a ratio of thickness of the first layer to thickness of the second layer is 1:1 to 1:3, wherein
the second layer of the multilayer coating comprises a residual stress of 15% to 60% less than the second layer if it were disposed directly on the chamber component, and
the second layer has an internal tensile stress, wherein the first layer has an internal compressive stress, and wherein the chamber component has an internal tensile stress.

14. The method of claim 13 , wherein forming the first layer comprises using atomic layer deposition (ALD), chemical vapor deposition (CVD), or physical vapor deposition (PVD), and wherein forming the second layer comprises using PVD or CVD.

15. The method of claim 13 , wherein the first layer has a thickness from about 50 microns to about 200 microns.

16. The method of claim 13 , wherein the second layer has a thickness from about 200 microns to 400 microns.

17. The method of claim 13 , wherein the first layer comprises a residual stress from about −900 MPa to about −1100 MPa and the second layer comprises a residual stress from about −400 MPa to about −600 MPa.

18. The method of claim 13 , wherein, during the forming of the multilayer coating, a temperature of the chamber component is from 180° C. to 220° C.

19. A method of forming a coating, comprising:
forming a multilayer coating on a chamber component configured to be used in a processing volume of a chamber, the chamber component comprising an aluminum alloy, the multilayer coating having a thickness of 250 microns to 600 microns, wherein, during the forming a temperature of the chamber component is from 20° C. to 300° C., the forming of the multilayer coating comprising:
forming a first layer disposed on and in contact with the chamber component to a thickness from about 50 microns to about 200 microns, wherein the first layer comprises titanium nitride (TiN); and
forming a second layer disposed on and in contact with the first layer to a thickness from about 200 microns to 400 microns, wherein the second layer comprises tungsten nitride (W 2 N), wherein a ratio of thickness of the first layer to thickness of the second layer is 1:1 to 1:3, wherein

the second layer of the multilayer coating comprises a residual stress of 15% to 60% less than the second layer if it were disposed directly on the chamber component, and
the second layer has an internal tensile stress, wherein the first layer has an internal compressive stress, and wherein the chamber component has an internal tensile stress.

20. The method of claim 19 , wherein the first layer comprises a residual stress from about −900 MPa to about −1100 MPa and the second layer comprises a residual stress from about −400 MPa to about −600 MPa.

Assignees

• Applied Materials Inc

Inventors

• Balaraman Karthikeyan
• Bindiganavale Sathyanarayana
• Patibandla Rajasekhar
• Ramasamy Balamurugan
• Shah Kartik
• Kelkar Umesh M
• Larsson Mats
• Papke Kevin A
• Lu William M

Classifications

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H01J37/32477 Primary

  characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title

• C23C14/0641

  Nitrides (C23C14/0617 takes precedence) · CPC title

• C23C14/16

  on metallic substrates or on substrates of boron or silicon · CPC title

• C23C16/06

  characterised by the deposition of metallic material · CPC title