Integrated optical transceiver

Patent metadata

Field	Value
Publication number	US-11791899-B2
Application number	US-202217857397-A
Country	US
Kind code	B2
Filing date	Jul 5, 2022
Priority date	Dec 6, 2019
Publication date	Oct 17, 2023
Grant date	Oct 17, 2023

Abstract

An optical transceiver includes a silicon photonics substrate, transmitter circuitry, and receiver circuitry that are heterogeneously integrated. The transmitter circuitry includes a plurality of laser devices formed on the silicon photonics substrate, each of the plurality of laser devices configured to generate a respective laser light, a plurality of modulators formed on the silicon photonics substrate, each of the plurality of modulators configured to modulate the laser lights based on driver signals and output, from the silicon photonics substrate, the modulated laser lights, and a driver formed on the silicon photonics substrate and configured to generate the driver signals. The receiver circuitry includes a photodetector configured to receive a plurality of optical signals and convert the plurality of optical signals to respective electrical signals and a transimpedance amplifier device configured to receive the electrical signals and output the electrical signals from the silicon photonics substrate as electrical outputs.

First claim

What is claimed is:

1. An optical transceiver, comprising:
a silicon photonics substrate;
transmitter circuitry provided on the silicon photonics substrate, the transmitter circuitry configured to (i) modulate laser lights received from a plurality of laser devices based on driver signals and (ii) output, from the silicon photonics substrate, the modulated laser lights; and
receiver circuitry provided on the silicon photonics substrate, the receiver circuitry configured to receive a plurality of optical signals and convert the plurality of optical signals to respective electrical signals,
the transmitter circuitry and the receiver circuitry being mounted on respective substrates, and the respective substrates being mounted on the silicon photonics substrate.

2. The optical transceiver of claim 1 , wherein the transmitter circuitry comprises the plurality of laser devices formed on the silicon photonics substrate, each of the plurality of laser devices being configured to generate a respective laser light.

3. The optical transceiver of claim 2 , wherein each of the plurality of laser devices is flip-chip mounted on the silicon photonics substrate.

4. The optical transceiver of claim 2 , wherein the transmitter circuitry further comprises a plurality of modulators formed on the silicon photonics substrate, each of the plurality of modulators configured to modulate the laser lights based on the driver signals to generate the modulated laser lights.

5. The optical transceiver of claim 1 , further comprising a driver formed on the silicon photonics substrate and configured to generate the driver signals.

6. The optical transceiver of claim 1 , wherein the receiver circuitry comprises a photodetector configured to receive the plurality of optical signals and convert the plurality of optical signals to the respective electrical signals.

7. The optical transceiver of claim 6 , wherein the receiver circuitry further comprises a transimpedance amplifier device configured to receive the electrical signals and output the electrical signals from the silicon photonics substrate as electrical outputs.

8. The optical transceiver of claim 7 , wherein the transimpedance amplifier device is flip--chip mounted on the silicon photonics substrate.

9. The optical transceiver of claim 1 , further comprising a planar light circuit configured to (i) receive, as inputs to the optical transceiver, optical light signals and (ii) transmit, as an output from the optical transceiver, a multiplexed light signal.

10. An optical transceiver, comprising:
a silicon photonics substrate;
transmitter circuitry provided on the silicon photonics substrate, the transmitter circuitry configured to (i) modulate laser lights received from a plurality of laser devices based on driver signals and (ii) output, from the silicon photonics substrate, the modulated laser lights;
receiver circuitry provided on the. silicon photonics substrate, the receiver circuitry configured to receive a plurality of optical signals and convert the plurality of optical signals to respective electrical signals,
the silicon photonics substrate, the transmitter circuitry, and the receiver circuitry being heterogeneously integrated; and
a planar light circuit configured to (i) receive, as inputs to the optical transceiver, optical light signals and (ii) transmit, as an output from the optical transceiver, a multiplexed light signal, the planar light circuit being disposed on a glass substrate mounted on the silicon photonics substrate.

11. A sealed package comprising a plurality of the optical transceivers of claim 1 formed on a common substrate.

12. The sealed package of claim 11 , further comprising a plurality of planar light circuits each associated with at least one of the optical transceivers, the planar light circuits configured to receive, as inputs to the sealed package, optical light signals and transmit, as an output from the sealed package, a multiplexed light signal.

13. An optics module comprising the optical transceiver of claim 1 , the optics module further comprising a printed circuit board, the optical transceiver being mounted on the printed circuit board.

14. An optical transceiver, comprising:
a silicon photonics substrate;
transmitter circuitry provided on the silicon photonics substrate, the transmitter circuitry configured to 0 ) modulate laser lights received from a plurality of laser devices based on driver signals and (ii) output, from the silicon photonics substrate, the modulated laser lights; and
receiver circuitry provided on the silicon photonics substrate, the receiver circuitry configured to receive a plurality of optical signals and convert the plurality of optical signals to respective electrical signals,
the silicon photonics substrate, the transmitter circuitry, and the receiver circuitry being heterogeneously integrated in silicon.

15. The optical transceiver of claim 1 , wherein the respective substrates of the transmitter circuitry and the receiver circuitry and the silicon photonics substrate are fabricated using different technologies including silicon-on-insulator and complementary metal-oxide semiconductor technologies.

Assignees

• Marvell Asia Pte Ltd

Inventors

• Liang Ding
• Patterson Mark
• Coccioli Roberto
• Nagarajan Radhakrishnan L

Classifications

• B60G21/05

  between wheels on the same axle but on different sides of the vehicle, i.e. the left and right wheel suspensions being interconnected · CPC title

• B60G15/02

  having mechanical spring · CPC title

• B62D63/02

  Motor vehicles · CPC title

• B62D7/20

  Links, e.g. track rods (means for adjusting camber, castor, or toe-in B62D17/00) · CPC title

• B62D7/146

  characterised by comprising means for steering by acting on the suspension system, e.g. on the mountings of the suspension arms · CPC title