Test system including active thermal interposer device

Patent metadata

Field	Value
Publication number	US-11774492-B2
Application number	US-202217841491-A
Country	US
Kind code	B2
Filing date	Jun 15, 2022
Priority date	Dec 4, 2020
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

First claim

We claim:

1. A testing device for testing a device under test (DUT), said testing device comprising:
a cold plate;
an active thermal interposer device disposed between said cold plate and said DUT, said active thermal interposer including a plurality of heating zones; and
a thermal controller coupled to said cold plate and said active thermal interposer device, said thermal controller operable to control said cold plate and to individually control each of said plurality of heating zones of said active thermal interposer device to heat and cool different regions of said DUT to different temperatures.

2. The testing device of claim 1 , further comprising an insulation cover for insulating said cold plate, wherein said insulation cover comprises an injection port operable to reduce condensation from said cold plate during said testing.

3. The testing device of claim 1 , further comprising a system of liquid cooling to remove heat from said cold plate.

4. The testing device of claim 1 , further comprising a system of gaseous cooling to remove heat from said cold plate.

5. The testing device of claim 1 , further comprising a phase-change cooling system to remove heat from said cold plate.

6. The testing device of claim 1 , further comprising a thermal interface material layer disposed between said active thermal interposer device and said cold plate, said thermal interface material layer operable to couple thermal energy from said active thermal interposer device to said cold plate.

7. The testing device of claim 6 wherein said thermal interface material layer comprises a plurality of cutouts configured to restrict a pick and place handler from adhering to said thermal interface material layer.

8. The testing device of claim 1 , wherein said plurality of heating zones comprise resistive heaters.

9. The testing device of claim 1 , wherein said plurality of heating zones comprise a Peltier device.

10. The testing device of claim 1 , wherein said active thermal interposer device is customized for a type of said DUT.

11. The testing device of claim 1 , wherein said active thermal interposer device comprises a base layer of aluminum nitride (AlN) with tungsten traces.

12. The testing device of claim 1 , wherein said active thermal interposer device comprises a base layer of aluminum nitride (AlN) with molybdenum traces.

13. The testing device of claim 1 , further comprising a system of liquid cooling to remove heat from said cold plate, wherein a liquid used for said liquid cooling comprises glycol.

14. The testing device of claim 1 , wherein said plurality of heating zones comprise resistive traces disposed on a ceramic substrate.

15. The testing device of claim 1 , wherein said plurality of heating zones comprise one or more cartridge heaters.

16. A testing arrangement for testing a device under test (DUT), wherein said arrangement comprising:
a socket device for containing said DUT and for interfacing said DUT with a load board;
a cold plate;
an active thermal interposer device disposed between said cold plate and said DUT, said active thermal interposer device including a plurality of heating zones; and
a thermal controller for coupling with said cold plate and said active thermal interposer, said thermal controller comprising firmware operable to control said cold plate and to individually control said plurality of heating zones of said active thermal interposer device to heat and cool different regions of said DUT to different temperatures to perform thermal regulation during testing of said DUT.

17. The testing arrangement of claim 16 , wherein said firmware is operable to:
obtain first temperatures which are of said cold plate from a temperature sensor of said cold plate;
obtain second temperatures of each heating zone of said active thermal interposer using respective resistance temperature detectors;
obtain third temperatures of each area of said DUT provided said DUT is active and circuitry on said load board is operable to collect a junction temperature for each area of said DUT;
based on said first temperatures, perform an outer slower control loop to regulate a fan speed for air control, or a fluid regulation valve for liquid/refrigerant control of said cold plate; and
based on said second and third temperatures, perform an inner faster control loop to regulate heater control/Peltier control of said plurality of heating zones of said active thermal interposer device.

18. The testing arrangement of claim 17 wherein said temperature sensor of said cold plate comprises a thermocouple.

19. The testing arrangement of claim 17 wherein said temperature sensor of said cold plate comprises a resistance temperature detector.

20. A testing arrangement for testing an electronic device under test (DUT), said arrangement comprising:
a socket device for securing said DUT and for interfacing with a load board;
a cold plate;
a stand-alone active thermal interposer device disposed between said cold plate and said DUT for use in testing said DUT, said active thermal interposer device including a plurality of heating zones;
a thermal controller for coupling with said cold plate and said active thermal interposer; said thermal controller comprising firmware operable to control said cold plate and to individually control each of said plurality of heating zones of said active thermal interposer device to heat and cool different regions of said DUT to different temperatures to perform thermal regulation during testing of said DUT; and
a thermal interface material layer disposed between said active thermal interposer device and said cold plate for coupling thermal energy from said active thermal interposer device to said cold plate.

21. The testing arrangement of claim 20 , wherein said firmware operable to:
obtain first temperatures which are of said cold plate from a temperature sensor of said cold plate;
obtain second temperatures of each heating zone of said active thermal interposer;
obtain third temperatures of each area of said DUT;
based on said first temperatures, perform a first control loop to regulate one of: a fan speed; and a fluid regulation valve of said cold plate; and
based on said second and third temperatures, perform a second control loop to regulate one of: heater control; and Peltier control of said plurality of heating zones of said active thermal interposer device.

22. The testing arrangement of claim 21 wherein said temperature sensor of said cold plate comprises a thermocouple.

23. The testing arrangement of claim 21 wherein said temperature sensor of said cold plate comprises a resistance temperature detector.

Assignees

• Advantest Test Solutions Inc

Inventors

• Kabbani Samer
• Ferrari Paul
• Hiroki Ikeda
• Toshiyuki Kiyokawa
• Cruzan Gregory
• Ranganathan Karthik
• Berk Todd
• Williams Ian
• Ghazvini Mohammad
• Jones Tom

Classifications

• G01R31/2875 Primary

  related to heating · CPC title

• G01R1/0458

  related to environmental aspects, e.g. temperature · CPC title

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2867

  Handlers or transport devices, e.g. loaders, carriers, trays · CPC title

• G01R31/2874

  related to temperature · CPC title