Method for manufacturing circuit board including metal-containing layer

Patent metadata

Field	Value
Publication number	US-11770903-B2
Application number	US-202117511572-A
Country	US
Kind code	B2
Filing date	Oct 27, 2021
Priority date	Oct 27, 2020
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

First claim

What is claimed is:

1. A method for manufacturing a circuit board, the method comprising:
(a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator;
(b) immersing a dielectric substrate in the mixture;
(c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere;
(d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and
(e) forming a metal pattern on the dielectric substrate, wherein
the first metal layer comprises Cu, Ni, Co, Au, Pd, or an alloy thereof,
the second metal layer comprises Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof,
the anti-sintering agent comprises Ti x O y wherein X>y, TiN, TIC, or a combination thereof, and
the method further comprises performing heat treatment at least once after step (c).

2. The method of claim 1 , wherein the metal powder is a Ti powder, and the metal-containing layer is a Ti-containing layer.

3. The method of claim 2 , wherein the anti-sintering agent further comprises Al 2 O 3 , TiO 2 , MgO, or a combination thereof.

4. The method of claim 3 , wherein the anti-sintering agent is in a form of a powder.

5. The method of claim 2 , wherein the mixture comprises 2% to 32% of the Ti powder, 0.04% to 0.64% of the activator, and the remainder of the anti-sintering agent based on a total weight of the mixture.

6. The method of claim 2 , wherein the heating of step (c) is performed at a temperature of 700° C. to 1200° C.

7. The method of claim 2 , the activator is used in an amount of 0.1 parts by weight to 20 parts by weight based on 100 parts by weight of the Ti powder.

8. The method of claim 2 , wherein the dielectric substrate is a nitride.

9. The method of claim 8 , wherein the nitride comprises one of AIN, Si 3 N 4 , and BN.

10. The method of claim 1 , wherein the metal powder is an Al-containing or Cr-containing metal powder,
the metal-containing layer is an Al-containing or Cr-containing layer,
the anti-sintering agent comprises Al 2 O 3 , and
the dielectric substrate is a Si 3 N 4 substrate.

11. The method of claim 10 , wherein the heating of step (c) is performed at a temperature of 500° C. to 1200° C.

12. The method of claim 10 , wherein the activator is used in an amount of 0.1 parts by weight to 20 parts by weight based on 100 parts by weight of Al or Cr powder.

13. The method of claim 1 , wherein the performing of heat treatment comprises heat-treating the dielectric substrate on which the metal pattern is formed after step (e).

14. The method of claim 1 , wherein the performing of heat treatment comprises heat-treating the dielectric substrate on which the second metal layer is formed after step (d) and before step (e).

15. The method of claim 1 , wherein the performing of heat treatment is performed by heat-treating the dielectric substrate after the electroless plating in step (d) and then the second metal layer is formed by electroplating.

16. The method of claim 1 , wherein the second metal layer comprises an Fe—Ni alloy layer or an Ni—Cr alloy layer.

17. The method of claim 16 , wherein the Fe—Ni alloy layer comprises an INVAR alloy.

18. The method of claim 16 , wherein the Ni—Cr alloy layer comprises a nichrome alloy.

19. The method of claim 1 , wherein the second metal layer comprises a soft magnetic thin-film formed of at least one of Fe, Ni, and Co.

20. The method of claim 1 , wherein the activator comprises at least one selected from the group consisting of a chloride, a fluoride, and an iodide.

21. The method of claim 20 , wherein
the chloride is at least one selected from the group consisting of NaCl, KCl, LiCl, CaCl 2 ), BaCl 2 , and NH 4 Cl,
the fluoride is at least one selected from the group consisting of NaF, KF, LiF, MgF 2 , CaF 2 , BaF 2 , and NH 4 F, and
the iodide is at least one selected from the group consisting of NaI, KI, LiI, MgI 2 , CaI 2 , BaI 2 , and NH 4 I.

22. The method of claim 1 , wherein a heating time in step (c) is from 0.1 minutes to 120 minutes.

23. The method of claim 1 , wherein a heating temperature is from 400° C. to 1000° C.

24. The method of claim 1 , wherein a heating time is from 0.1 minutes to 120 minutes.

25. The method of claim 1 , wherein the heating is performed under a reducing atmosphere.

Assignees

• Korea Inst Sci & Tech

Inventors

• Byun Ji Young
• Choi Kwang-Deok
• Cheon Honguk

Classifications

• H05K3/388 Primary

  by the use of a metallic or inorganic thin film adhesion layer · CPC title

• C23C18/1817

  Heat · CPC title

• C23C18/31

  Coating with metals · CPC title

• C23C28/023

  only coatings of metal elements only · CPC title

• C23F1/02

  Local etching · CPC title