Method for manufacturing circuit board including metal-containing layer
US-11770903-B2 · Sep 26, 2023 · US
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Patent family 78413636
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 78413636 |
| Family type | — |
| Earliest priority | Oct 27, 2020 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11770903B2 — Method for manufacturing circuit board including metal-containing layer |
Representative publication
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US11770903B2 — Method for manufacturing circuit board including metal-containing layer (published Sep 26, 2023)
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