Polyfunctional phenolic resin, polyfunctional epoxy resin, curable resin composition containing these, and cured product thereof

Patent metadata

Field	Value
Publication number	US-11767424-B2
Application number	US-202017767241-A
Country	US
Kind code	B2
Filing date	Oct 1, 2020
Priority date	Oct 25, 2019
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.

First claim

The invention claimed is:

1. A polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent;
wherein the polyfunctional phenolic resin is represented by Structural Formula (1) below:

in Structural Formula (1), R is a hydrogen atom, an alkyl group, or an aryl group; R 1 is a hydrogen atom or a methyl group; R 2 is a hydrogen atom or an alkyl group; n is an integer of 0 to 3; m is an integer of 0 to 6; 1 is an integer of 1 to 4; n+1 is 4; and a plurality of R 1 and R 2 are optionally same as or different from each other.

2. The polyfunctional phenolic resin according to claim 1 , wherein R, R 1 , and R 2 in Structural Formula (1) above are hydrogen atoms.

3. A curable resin composition comprising:
the polyfunctional phenolic resin according to claim 1 ; and
a curing agent (X).

4. A cured product of the curable resin composition according to claim 3 .

5. A fiber-reinforced composite material comprising:
the curable resin composition according to claim 3 ; and
reinforcing fibers.

6. A fiber-reinforced molded article as a cured product of the fiber-reinforced composite material according to claim 5 .

7. A semiconductor sealing material comprising:
the curable resin composition according to claim 3 ; and
an inorganic filler.

8. A semiconductor device comprising a cured product of the semiconductor sealing material according to claim 7 .

9. A prepreg as a semi-cured product of an impregnated base material comprising the curable resin composition according to claim 3 and a reinforcing base material.

10. A circuit board comprising:
a plate-shaped body of the curable resin composition according to claim 3 ; and
copper foil.

11. A build-up film comprising:
a cured product of the curable resin composition according to claim 3 ; and
a base film.

12. A polyfunctional epoxy resin as a reaction product of a polyfunctional phenolic compound formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent and epihalohydrin;
wherein the polyfunctional epoxy resin is represented by Structural Formula (2) below:

in Structural Formula (2), G is a glycidyl group; R is a hydrogen atom, an alkyl group, or an aryl group, R 1 is a hydrogen atom or a methyl group; R 2 is a hydrogen atom or an alkyl group; n is an integer of 0 to 3; m is an integer of 0 to 6; 1 is an integer of 1 to 4; n+1 is 4; and a plurality of R 1 and R 2 are optionally same as or different from each other.

13. The polyfunctional epoxy resin according to claim 12 , wherein R, R 1 and R 2 in Structural Formula (2) above are hydrogen atoms.

14. A curable resin composition comprising:
the polyfunctional epoxy resin according to claim 12 ; and
a curing agent (Y).

15. A cured product of the curable resin composition according to claim 14 .

16. A fiber-reinforced composite material comprising:
the curable resin composition according to claim 14 ; and
reinforcing fibers.

17. A semiconductor sealing material comprising:
the curable resin composition according to claim 14 ; and
an inorganic filler.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Onda Shinji
• Morinaga Kunihiro

Classifications

• C08L61/12 Primary

  with polyhydric phenols · CPC title

• C08G59/06

  of polyhydric phenols · CPC title

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

• C08J2361/12

  with polyhydric phenols · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title