Method of forming a plurality of gratings

Patent metadata

Field	Value
Publication number	US-11766744-B2
Application number	US-202217650814-A
Country	US
Kind code	B2
Filing date	Feb 11, 2022
Priority date	Dec 17, 2018
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

Embodiments of the present application generally relate to methods for forming a plurality of gratings. The methods generally include depositing a material over one or more protected regions of a waveguide combiner disposed on a substrate, the material having a thickness inhibiting removal of a grating material disposed on the waveguide combiner when an ion beam is directed toward the substrate, and directing the ion beam toward the substrate. The methods disclosed herein allow for formation of a plurality of gratings in one or more unprotected regions, while no gratings are formed in the protected regions.

First claim

What is claimed is:

1. A method of forming a first plurality of gratings, comprising:
disposing a protective material between portions of a patterned hardmask on a grating material, the protective material having a thickness from a planar top surface of the grating material to an upper surface of the protective material, the thickness of the protective material varying along the planar top surface of the grating material; and
etching the grating material to remove at least a portion of the grating material to form the first plurality of gratings in the grating material, the first plurality of gratings including:
a depth profile that corresponds with the thickness of the protective material, wherein the protective material at least partially inhibits removal of the grating material such that at least two gratings of the first plurality of gratings have different depths than each other.

2. The method of claim 1 , further comprising:
disposing the protective material over a first portion and a second portion of the grating material such that the protective material totally inhibits removal of the grating material in the first portion; and
removing the protective material over the second portion.

3. The method of claim 2 , wherein
the protective material disposed over the first portion is thicker than the protective material disposed over the second portion.

4. The method of claim 1 , wherein the thickness of the protective material varies in two dimensions over the first plurality of gratings.

5. The method of claim 1 , wherein the protective material is disposed by one of inkjet printing or three-dimensional printing.

6. The method of claim 1 , wherein the etching is performed with an ion beam.

7. A method of forming a plurality of gratings, comprising:
disposing a protective material between portions of a patterned hardmask on a first portion of a grating material adjacent to a second portion of the grating material, the protective material including a thickness from a planar top surface of the grating material to an upper surface of the protective material; and
etching the first portion and the second portion of the grating material to remove at least a portion of the grating material to form a first plurality of gratings in the first portion and a second plurality of gratings in the second portion, the first plurality of gratings including:
a first depth that is less than a second depth of the second plurality of gratings; and
a depth profile that corresponds with the thickness of the protective material, wherein the protective material at least partially inhibits removal of the grating material in the first portion.

8. The method of claim 7 , further comprising:
disposing the protective material on the second portion of the grating material.

9. The method of claim 8 , wherein
the protective material disposed over the first portion is thicker than the protective material disposed over the second portion.

10. The method of claim 8 , wherein the protective material disposed over the second portion has a second thickness that varies across the grating material.

11. The method of claim 10 , wherein the thickness of the protective material disposed over the first portion varies linearly across the grating material.

12. The method of claim 7 , wherein at least one of the gratings of the first plurality of gratings has a different thickness than other gratings of the first plurality of gratings.

13. The method of claim 7 , wherein
the disposing the protective material is repeated, and the etching is repeated.

14. A method of forming a plurality of gratings, comprising:
disposing a protective material between portions of a patterned hardmask on a first portion of a grating material and on a second portion of the grating material adjacent to the first portion, the protective material including:
a first thickness from a planar top surface of the first portion to an upper surface of the protective material; and
a second thickness from the planar top surface of the second portion to the upper surface of the protective material, wherein the first thickness is less than the second thickness; and

etching the first portion and the second portion of the grating material to form a first plurality of gratings in the first portion, the first plurality of gratings including:
a depth profile that corresponds with the first thickness of the protective material, wherein the protective material at least partially inhibits removal of the grating material in the first portion and completely inhibits removal of the grating material in the second portion.

15. The method of claim 14 , further comprising exposing the protective material to a plurality of heating pixels or light-emitting diodes (LEDs).

16. The method of claim 15 , wherein each of the plurality of the heating pixels or LEDs is individually controlled.

17. The method of claim 16 , wherein a temperature distribution corresponding to the first portion is provided to a back-side of a substrate disposed under the grating material.

18. The method of claim 14 , wherein at least one of the gratings of the first plurality of gratings has a different thickness than other gratings of the first plurality of gratings.

19. The method of claim 14 , wherein the protective material comprises a photoresist.

20. The method of claim 19 , wherein the protective material comprises SU-8.

Assignees

• Applied Materials Inc

Inventors

• Evans Morgan
• Olson Joseph C
• Meyer Timmerman Thijssen Rutger

Classifications

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• B29D11/00769

  Producing diffraction gratings · CPC title

• H10W90/00

  Package configurations · CPC title

• H10P30/202

  characterised by the semiconductor materials · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title