Solder paste bead recovery system and method

US11766730B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11766730-B2
Application numberUS-202217725058-A
CountryUS
Kind codeB2
Filing dateApr 20, 2022
Priority dateJun 13, 2019
Publication dateSep 26, 2023
Grant dateSep 26, 2023

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

First claim

Opening claim text (preview).

What is claimed is: 1. A stencil printer for printing an assembly material on an electronic substrate, the stencil printer comprising: a frame; a stencil coupled to the frame, the stencil having apertures formed therein; a support assembly coupled to the frame, the support assembly being configured to support the electronic substrate; a print head gantry coupled to the frame; a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes; and an assembly material recovery system configured to remove assembly material from a top surface of the stencil and to deposit assembly material onto a new replacement stencil, the recovery system including at least one tooling member coupled to the print head gantry and configured to move laterally on the print head gantry and a receptacle configured to be positioned on the top surface of the stencil, the receptacle including at least one receiving feature, wherein the at least one tooling member includes a downwardly extending pin having a head configured to be received within the receiving feature to engage and move the receptacle. 2. The stencil printer of claim 1 , wherein the receptacle is positioned on the top surface of the stencil from a storage location, which is a rail of a stencil support assembly, to a top surface of the stencil. 3. The stencil printer of claim 1 , wherein the receptacle includes a flat bottom wall configured to rest on a flat surface and to enable the assembly material to be rolled thereon. 4. The stencil printer of claim 1 , wherein the print head gantry includes an elongate beam that rides along rails provided on the frame, the elongate beam of the print head gantry including at least one linear bearing that extends in a horizontal direction, the at least one tooling member being configured to move laterally on the at least one linear bearing. 5. The stencil printer of claim 4 , wherein the at least one tooling member includes two spaced-apart tooling members, each including a pin, a first tooling member being configured to move laterally on a first linear bearing and a second tooling member being configured to move laterally on a second linear bearing. 6. The stencil printer of claim 5 , wherein the at least one receiving feature includes two receiving features, one for each tooling member, the head of the pin of each of the first and second tooling members being received in a respective mating feature of the receptacle to releasably secure the receptacle. 7. The stencil printer of claim 1 , wherein the support assembly is configured to be moved in a z-axis direction and elevated to engage magnets mounted in a bottom of the receptacle, the support assembly including a steel surface to secure the receptacle in place on the stencil. 8. The stencil printer of claim 1 , wherein the print head assembly includes a print head having a squeegee blade assembly configured to move assembly material along the stencil, the squeegee blade assembly including a first squeegee blade configured to engage the stencil and roll assembly material into the receptacle. 9. The stencil printer of claim 8 , wherein the squeegee blade assembly further includes a second squeegee blade configured to engage the receptacle and roll assembly material onto the stencil. 10. An assembly material recovery system configured to remove assembly material from a top surface of a stencil of a stencil printer and to deposit assembly material to deposit assembly material on a new replacement stencil, the recovery system comprising: at least one tooling member coupled to a print head gantry of the stencil printer and configured to move laterally on the print head gantry; and a receptacle configured to be positioned on the top surface of the stencil, the receptacle including at least one receiving feature, wherein the at least one tooling member includes a downwardly extending pin having a head configured to be received within the receiving feature to engage and move the receptacle. 11. The recovery system of claim 10 , wherein the receptacle includes a flat bottom wall configured to rest on the flat surface and to enable assembly material to be moved thereon. 12. The recovery system of claim 10 , wherein an elongate beam of the print head gantry includes at least one linear bearing that extends in a horizontal direction. 13. The recovery system of claim 12 , wherein the pin of the at least one tooling member is configured to engage and move the receptacle from a storage location to the top surface of the stencil. 14. The recovery system of claim 12 , wherein the at least one tooling member includes two spaced-apart tooling members, each including a pin, a first tooling member being configured to move laterally on a first linear bearing and a second tooling member being configured to move laterally on a second linear bearing. 15. The recovery system of claim 14 , wherein the at least one receiving feature includes two receiving features, one for each tooling member, the head of the pin of each first and second tooling members being received in a respective mating feature of the receptacle to releasably secure the receptacle. 16. The recovery system of claim 10 , wherein a support assembly of the stencil printer is configured to be moved in a z-axis direction and elevated to engage magnets mounted in a bottom of the receptacle, the support assembly including a steel surface to secure the receptacle in place on the stencil.

Assignees

Inventors

Classifications

  • B23K3/0638Primary

    for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

  • Auxiliary devices therefor · CPC title

  • B41F15/423Primary

    Driving means for reciprocating squeegees · CPC title

  • for printing on polyhedral articles · CPC title

  • Ink-removing or collecting devices · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11766730B2 cover?
A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gan…
Who is the assignee on this patent?
Illinois Tool Works
What technology area does this patent fall under?
Primary CPC classification B23K3/0638. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 26 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).