Metal magnetic film and magnetic sheet

US11765874B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11765874-B2
Application numberUS-202016932046-A
CountryUS
Kind codeB2
Filing dateJul 17, 2020
Priority dateSep 27, 2018
Publication dateSep 19, 2023
Grant dateSep 19, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a metal magnetic film, comprising: forming the metal magnetic film by a plating process, wherein: the metal magnetic film comprises a permalloy and carbon atoms; a content of the carbon atoms is 1.0 to 3.0 at % based on a total amount of the carbon atoms and metal elements; and a thickness of the metal magnetic film is 1 to 10 μm. 2. The method according to claim 1 , wherein: the metal magnetic film is formed on a support by an electroplating process so as to produce a magnetic sheet; and the electroplating process comprises dipping the support in an electroplating bath containing compounds that provide ions of the metal elements and a compound that is a carbon source. 3. The method according to claim 2 , wherein the support comprises a non-magnetic metal layer, and a resin layer provided on a surface of the non-magnetic metal layer on an opposite side to the metal magnetic film. 4. The method according to claim 2 , wherein the magnetic sheet is a noise suppression sheet. 5. The method according to claim 2 , wherein a content of the compounds that provide ions of the metal elements in the electroplating bath is 1 to 400 g/L. 6. The method according to claim 2 , wherein a content of the compound that is a carbon source in the electroplating bath is 0.1 to 5.0 g/L. 7. The method according to claim 2 , wherein: the electroplating process uses a current density of 0.5 to 5 A/dm 2 ; the support is dipped in the electroplating bath for 5 to 90 minutes; and the electroplating bath has a temperature of 35 to 50° C. and a pH of 2 to 3. 8. The method according to claim 2 , wherein the support comprises a pressure-sensitive adhesive layer, a non-magnetic metal layer, and a resin layer provided on a surface of the non-magnetic metal layer on an opposite side to the metal magnetic film. 9. The method according to claim 1 , wherein the permalloy contains iron (Fe) and nickel (Ni) in a mass ratio of Fe to Ni (Fe/Ni) that is from 15 to 40. 10. The method according to claim 1 , wherein the permalloy contains iron (Fe) and nickel (Ni) in a mass ratio of Fe to Ni (Fe/Ni) that is from 18 to 25.

Assignees

Inventors

Classifications

  • H01F10/12Primary

    being metals or alloys (intermetallic compounds H01F10/18) · CPC title

  • H05K9/0088Primary

    comprising a plurality of shielding layers; combining different shielding material structure · CPC title

  • H05K9/0075Primary

    Magnetic shielding materials · CPC title

  • H05K9/0083Primary

    comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers (H05K9/0086 takes precedence) · CPC title

  • containing iron or nickel ({H01F10/126} , H01F10/13, H01F10/16 take precedence) · CPC title

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What does patent US11765874B2 cover?
A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.
Who is the assignee on this patent?
Tdk Corp
What technology area does this patent fall under?
Primary CPC classification H01F10/12. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).