Composite substrate for antenna module and preparation method thereof

Patent metadata

Field	Value
Publication number	US-10218064-B2
Application number	US-201615305413-A
Country	US
Kind code	B2
Filing date	Aug 30, 2016
Priority date	Jul 11, 2016
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

The present disclosure provides a composite substrate for an antenna module, which includes: a first non-magnetic substrate that is configured to have a first copper foil; a second non-magnetic substrate that is configured to have a second copper foil; and a magnetic sheet that is configured to be interposed between the first non-magnetic substrate and the second non-magnetic substrate and that is configured to be integrally laminated with the non-magnetic substrates, and further provides a preparation method thereof. The present disclosure provides a simplification of a process, low costs, a slim design, and a grip-feeling of a metal material while providing functions of wireless charging, MST, and NFC.

First claim

What is claimed is:

1. A composite substrate for an antenna module, the composite substrate comprising:
a first non-magnetic substrate configured to have a first copper foil;
a second non-magnetic substrate configured to have a second copper foil; and
a magnetic sheet configured to be interposed between the first non-magnetic substrate and the second non-magnetic substrate and configured to be integrally laminated with the non-magnetic substrates,
wherein the composite substrate further comprises at least one of a first insulating adhesion layer and a second insulating adhesion layer, said first insulating adhesion layer being interposed between the first non-magnetic substrate and the magnetic sheet, and said second insulating adhesion layer being interposed between the second non-magnetic substrate and the magnetic sheet; and
wherein a peel strength of the first insulating adhesion layer or the second insulating adhesion layer with respect to the magnetic sheet is 0.6 to 3.0 kgf/cm 2 .

2. The composite substrate according to claim 1 , wherein the composite substrate is configured to be integrated, through a roll-to-roll process, in the form of a roll that extends in the longitudinal direction.

3. The composite substrate according to claim 1 , wherein the magnetic sheet is configured to include a magnetic powder and a polymer resin.

4. The composite substrate according to claim 3 , wherein the magnetic powder is selected from the group consisting of a metal powder, a metal flake, and ferrite, which have magnetism.

5. The composite substrate according to claim 3 , wherein the polymer resin is selected from the group consisting of non-halogen-based epoxy resin, silicone, urethane, polyimide, and polyamide.

6. The composite substrate according to claim 3 , wherein the magnetic sheet includes a magnetic powder of 70 to 95 wt % based on the total weight of the magnetic sheet, and the magnetic permeability thereof is 50 to 250.

7. The composite substrate according to claim 1 , wherein the composite substrate comprises:
(i) the first copper foil, the first insulating adhesion layer, the magnetic sheet, the second insulating adhesion layer, and the second copper foil;
(ii) the first copper foil, the first insulating adhesion layer, the magnetic sheet, and the second copper foil; or
(iii) the first copper foil, the magnetic sheet, the second insulating adhesion layer, and the second copper foil,
which are laminated in sequence.

8. The composite substrate according to claim 7 , wherein the thickness of the magnetic sheet is in the range of 20 to 150 μm, the thicknesses of the first copper foil and the second copper foil are in the range of 6 to 105 μm, and the thicknesses of the first insulating adhesion layer and the second insulating adhesion layer are in the range of 1 to 30 μm.

9. The composite substrate according to claim 1 , wherein the first insulating adhesion layer and second insulating adhesion layer are formed of a polymer resin selected from the group consisting of a polyimide and epoxy resin, respectively.

10. The composite substrate according to claim 9 , wherein the first insulating adhesion layer and second insulating adhesion layer further comprise one or more selected from the group consisting of thermoplastic resin, inorganic fillers and curing agents, respectively.

11. The composite substrate according to claim 1 , wherein the first and second non-magnetic substrates are flexible copper clad laminates (FCCL) or flexible printed circuit boards (FPCB), respectively.

12. The composite substrate according to claim 1 , wherein the total thickness of the composite substrate is in the range of 34 to 420 μm.

13. The composite substrate according to claim 1 , wherein the first copper foil and the second copper foil form a first antenna pattern portion and a second antenna pattern portion, respectively, which have a predetermined area, line width, and shape.

14. The composite substrate according to claim 13 , wherein the composite substrate have one or more through-holes that pass through the first non-magnetic substrate, the magnetic sheet, and the second non-magnetic substrate, and the first antenna pattern portion and the second antenna pattern portion are connected to each other through the through-holes.

15. The composite substrate according to claim 13 , further comprising at least one of a wireless charging (WPC) antenna pattern, a magnetic secure transmission (MST) antenna pattern, and a near field communication (NFC) antenna pattern.

16. A method for preparing a composite substrate for an antenna module of claim 1 , the method comprising:
(i) coating a thermosetting composition for a first insulating adhesion layer on one surface of a first copper foil and/or a thermosetting composition for a second insulating adhesion layer on one surface of a second copper foil, respectively, to then be dried; and
(ii) interposing a magnetic sheet between the first insulating adhesion layer of the first copper foil and the second insulating adhesion layer of the second copper foil, and laminating the same by applying roll lamination,
wherein the first insulating adhesion layer is interposed between the first non-magnetic substrate and the magnetic sheet; and the second insulating adhesion layer is interposed between the second non-magnetic substrate and the magnetic sheet, and
wherein a peel strength of the first insulating adhesion layer or the second insulating adhesion layer with respect to the magnetic sheet is 0.6 to 3.0 kgf/cm 2 .

Assignees

• Doosan Corp

Inventors

• Jung Yoon Ho
• Cho Hyung Min
• Jin Hyo Seung
• Baik Eun Song
• Lim Tae Geuk

Classifications

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H05K3/025

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• H01F1/37

  in a bonding agent · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title