Heat-assisted magnetic recording (HAMR) medium with heat-sink layer having anisotropic thermal conductivity

US10109309B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-10109309-B1
Application numberUS-201715694276-A
CountryUS
Kind codeB1
Filing dateSep 1, 2017
Priority dateSep 1, 2017
Publication dateOct 23, 2018
Grant dateOct 23, 2018

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Abstract

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A heat-assisted magnetic recording (HAMR) medium includes a perpendicular magnetic recording layer (typically a chemically-ordered FePt alloy), a seed/thermal barrier layer (typically MgO) below the recording layer, and a heat-sink layer with anisotropic thermal conductivity below the seed/thermal barrier layer. The in-plane thermal conductivity of the heat-sink layer is greater than its out-of-plane thermal conductivity. The heat-sink layer may be selected from hexagonal boron nitride (h-BN), hexagonal graphite, and the 6H polytype of hexagonal silicon carbide (6H-SiC). If the heat-sink layer is h-BN, the h-BN layer is formed on a seed layer and has its c-axis oriented out-of-plane (substantially orthogonal to the surface of the medium substrate).

First claim

Opening claim text (preview).

What is claimed is: 1. A heat-assisted magnetic recording medium comprising: a substrate; a heat-sink layer on the substrate, the heat-sink layer selected from the group consisting of hexagonal boron nitride (h-BN), hexagonal graphite, and the 6H polytype of hexagonal silicon carbide (6H-SiC) and having anisotropic thermal conductivity, the thermal conductivity in the plane of the heat-sink layer being greater than the thermal conductivity normal to the plane of the heat-sink layer; a magnetic recording layer; and a seed/thermal barrier layer for the recording layer on the heat-sink layer, wherein the recording layer is on and in contact with the seed/thermal barrier layer. 2. The medium of claim 1 wherein the ratio of thermal conductivity in the plane of the heat-sink layer to the thermal conductivity normal to the plane of the heat-sink layer is greater than 1.2. 3. The medium of claim 2 wherein the thermal conductivity in the plane of the heat-sink layer is greater than 50 W/mK. 4. The medium of claim 1 wherein the heat-sink layer comprises hexagonal boron nitride (h-BN) having its c-axis oriented substantially normal to the plane of the heat-sink layer, and further comprising a seed layer between the substrate and the heat-sink layer, wherein the heat-sink layer is on and in contact with the seed layer. 5. The medium of claim 4 wherein the seed layer for the heat-sink layer comprises a material having hexagonal crystalline structure with its [002] crystallographic direction oriented out-of-plane. 6. The medium of claim 5 wherein the seed layer for the heat-sink layer comprises a material selected from the group consisting of Ru, Ti, Co, Re, Zr and Zn. 7. The medium of claim 5 further comprising an amorphous adhesion layer between the substrate and the seed layer for the heat-sink layer, wherein the seed layer for the heat-sink layer is on and in contact with the adhesion layer. 8. The medium of claim 7 wherein the adhesion layer comprises an alloy comprising two or more elements selected from the group consisting of Cr, Ta and Ti. 9. The medium of claim 4 wherein the seed layer for the heat-sink layer comprises a material having a face-centered-cubic crystalline structure with its [111] crystallographic direction oriented out-of-plane. 10. The medium of claim 9 wherein the seed layer for the heat-sink layer comprises a material selected from the group consisting of Au, Ag, Sr, Ni, Pt, Pd, Cu, Ir and Rh. 11. The medium of claim 1 further comprising an amorphous underlayer between the heat-sink layer and the seed/thermal barrier layer, wherein the seed/thermal barrier layer is on and in contact with the underlayer. 12. The medium of claim 1 wherein the magnetic recording layer comprises a chemically-ordered alloy selected from a FePt alloy and a CoPt alloy, and wherein the seed/thermal barrier layer for the recording layer comprises MgO. 13. A heat assisted magnetic recording (HAMR) disk drive comprising: the medium according to claim 1 wherein said medium is a rotatable HAMR disk; and a carrier maintained near the magnetic recording layer of said medium and supporting a HAMR head, the HAMR head comprising a near-field transducer. 14. A heat-assisted magnetic recording (HAMR) disk comprising: a disk substrate having a substantially planar surface; a heat-sink layer on the substrate, the heat-sink layer comprising hexagonal boron-nitride (h-BN) having its c-axis oriented substantially orthogonal to the substrate surface; a seed layer for the heat-sink layer between the substrate and the heat-sink layer, wherein the heat-sink layer is on and in contact with the seed layer; a seed/thermal barrier layer comprising MgO on the heat-sink layer; and a perpendicular magnetic recording layer comprising a chemically-ordered alloy selected from a FePt alloy and a CoPt alloy on and in contact with the seed/thermal barrier layer. 15. The disk of claim 14 wherein the heat-sink layer comprising h-BN has anisotropic thermal conductivity, the ratio of thermal conductivity substantially orthogonal to the c-axis to thermal conductivity substantially parallel to the c-axis being greater than 1.2. 16. The disk of claim 15 wherein the thermal conductivity in the plane of the heat-sink layer is greater than 50 W/mK. 17. The disk of claim 14 wherein the seed layer for the heat-sink layer comprises a material having hexagonal crystalline structure with its [002] crystallographic direction oriented out-of-plane. 18. The disk of claim 14 wherein the seed layer for the heat-sink layer comprises a material having a face-centered-cubic crystalline structure with its [111] crystallographic direction oriented out-of-plane. 19. The disk of claim 14 further comprising an amorphous adhesion layer on and in contact with the substrate surface, wherein the seed layer for the heat-sink layer is on and in contact with the adhesion layer. 20. The disk of claim 14 further comprising an amorphous underlayer between the heat-sink layer and the seed/thermal barrier layer, wherein the seed/thermal barrier layer is on and in contact with the underlayer. 21. A heat assisted magnetic recording (HAMR) disk drive comprising: the disk according to claim 14 ; and a gas-bearing slider maintained near the magnetic recording layer of said disk and supporting a HAMR head, the HAMR head comprising a near-field transducer. 22. A heat-assisted magnetic recording medium comprising: a substrate; a heat-sink layer on the substrate, the heat-sink layer having anisotropic thermal conductivity, the thermal conductivity in the plane of the heat-sink layer being greater than the thermal conductivity normal to the plane of the heat-sink layer; a magnetic recording layer; a seed/thermal barrier layer for the recording layer on the heat-sink layer, wherein the recording layer is on and in contact with the seed/thermal barrier layer; and an amorphous underlayer between the heat-sink layer and the seed/thermal barrier layer, wherein the seed/thermal barrier layer is on and in contact with the underlayer.

Assignees

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Classifications

  • Physics · mapped topic

  • using near-field interactions or transducing means and at least one other method or means for recording or reproducing · CPC title

  • Fixed mounting {or arrangements, e.g. one head per track} · CPC title

  • Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

  • characterised by the composition · CPC title

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What does patent US10109309B1 cover?
A heat-assisted magnetic recording (HAMR) medium includes a perpendicular magnetic recording layer (typically a chemically-ordered FePt alloy), a seed/thermal barrier layer (typically MgO) below the recording layer, and a heat-sink layer with anisotropic thermal conductivity below the seed/thermal barrier layer. The in-plane thermal conductivity of the heat-sink layer is greater than its out-of…
Who is the assignee on this patent?
Western Digital Tech Inc
What technology area does this patent fall under?
Primary CPC classification G11B5/708. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 23 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).