Method for manufacturing surge absorbing device

Patent metadata

Field	Value
Publication number	US-11764547-B2
Application number	US-202117223381-A
Country	US
Kind code	B2
Filing date	Apr 6, 2021
Priority date	Aug 27, 2015
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

First claim

What is claimed is:

1. A method for manufacturing a surge absorbing device, the method comprising:
forming a first plating layer and a second plating layer on a first end and a second end of a ceramic tube having a hollow space defined of the ceramic tube and exposed through the first and second ends, respectively;
placing a surge absorbing element within the hollow space of the ceramic tube;
disposing first and second brazing rings on the first plating layer and the second plating layer, respectively;
disposing first and second sealing electrodes on the first and second brazing rings respectively; and
melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively,
wherein the forming of the first plating layer and the second plating layer on the first end and the second end respectively, comprises:
etching the first end and the second end of the ceramic tube;
forming first and second electroless plating catalyst layers on the etched first end and the etched second end respectively;
forming first and second metal layers on the first end and the second end of the ceramic tube respectively using an electroless plating process;
heat-treating the first and second metal layers,
wherein the first and second metal layers respectively comprise a first nickel/molybdenum alloy layer and a second nickel/molybdenum alloy layer, respectively, formed by the electroless plating process using a nickel/molybdenum alloy plating solution including a nickel precursor, a molybdenum precursor, and a reducing agent,
wherein the nickel precursor comprises ammonium nickel sulfate ((NH4)2Ni(SO4)2⋅7H2O),
wherein the molybdenum precursor comprises ammonium molybdate ((NH4)2MoO4),
wherein the reducing agent comprises at least one selected from the group of consisting of sodium hypophosphite (NaH2PO2), sodium borohydride (NaBH4), dimethylamine borane ((CH3)2NHBH3), and hydrazine (N2H4).

2. The method of claim 1 , wherein the nickel/molybdenum alloy plating solution comprises a solution prepared by mixing, with respect to 1 liter of distilled water, about 35 to 45 g of ammonium nickel sulfate ((NH4)2Ni(SO4)2·7H2O), about 1 to 4 grams of ammonium molybdate ((NH4)2MoO4), about 10 to 14 g of dimethylamine borane ((CH3)2NHBH3), and about 35 to 45 grams of ammonium citrate (HOC(CO2NH4)(CH2CO2NH4)2) to form a mixed solution and by adjusting the mixed solution to have a pH of about 8 to 9 with an aqueous solution of tetramethylammonium hydroxide ((CH3)4N(OH)).

Assignees

• Univ Ajou Ind Academic Coop Found
• Smart Electronics Inc
• Ajou Univ Academic Cooperation Foundation

Inventors

• Kim Chang-Koo
• Lee Hae-Min
• Kang Doo Won
• Kim Hyun Chang

Classifications

• H01T4/12 Primary

  hermetically sealed · CPC title

• H01T4/02

  Details · CPC title

• H01T21/00

  Apparatus or processes specially adapted for the manufacture or maintenance of spark gaps or sparking plugs · CPC title

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title