Peeling apparatus and manufacturing apparatus of semiconductor device
US-9570329-B2 · Feb 14, 2017 · US
US11760080B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11760080-B2 |
| Application number | US-202117445976-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 26, 2021 |
| Priority date | Jan 7, 2021 |
| Publication date | Sep 19, 2023 |
| Grant date | Sep 19, 2023 |
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A peeling device includes a peeling tank for containing a first solution therein, a support portion on which a stack structure including a base layer extending in a first direction and a film coupled with the base layer is disposed, the support portion being disposed in the peeling tank and an adsorption device for adsorbing the base layer thereon to peel off the base layer from the film, the adsorption device including an adsorption portion for adsorbing the base layer, and a moving portion coupled with the adsorption portion for moving the adsorption portion to allow the base layer to be bent to a second direction crossing the first direction and to be peeled off from the film.
Opening claim text (preview).
What is claimed is: 1. A peeling device comprising: a peeling tank containing a first solution therein; a support portion on which a stack structure comprising a base layer extending in a first direction and a film coupled with the base layer is disposed, the support portion being disposed in the peeling tank; and an adsorption device for adsorbing the base layer thereon to peel off the base layer from the film, the adsorption device comprising: an adsorption portion for adsorbing the base layer; and a moving portion coupled with the adsorption portion for moving the adsorption portion to allow the base layer to be bent to a second direction crossing the first direction and to be peeled off from the film. 2. The peeling device of claim 1 , wherein the first solution comprises water having a temperature from about 50° C. to about 90° C. 3. The peeling device of claim 1 , wherein the base layer comprises: an upper surface to be adsorbed to the adsorption portion; and a lower surface coupled with the film, and wherein the adsorption device is configured to peel the lower surface of the base layer off of the film. 4. The peeling device of claim 3 , further comprising a first nozzle, wherein the first nozzle faces a peeling area of the lower surface when the base layer is bent to the second direction by the adsorption device and sprays a second solution to the peeling area of the lower surface and the film, and the second solution comprises a same material as the first solution. 5. The peeling device of claim 4 , further comprising a second nozzle, wherein the second nozzle sprays a third solution to the upper surface, and the third solution comprises a same material as the first solution. 6. The peeling device of claim 1 , wherein the base layer comprises: a first base layer; and a second base layer, wherein the film comprises an adhesive film between the first and second base layers to attach the first base layer to the second base layer, and wherein the adsorption portion is configured to be adsorbed to the second base layer. 7. The peeling device of claim 6 , further comprising a grip device that grips the film to remove the film from the peeling tank. 8. The peeling device of claim 6 , wherein the moving portion is configured to move the adsorption portion with the second base layer adsorbed thereto to a second position from a first position such that the base layer is peeled off from the film before moving the adsorption portion to allow the second base layer to be bent to the second direction. 9. The peeling device of claim 1 , wherein the second direction is substantially perpendicular to the first direction. 10. The peeling device of claim 1 , wherein the base layer comprises a thin film glass substrate. 11. The peeling device of claim 1 , wherein the adsorption portion comprises: a plurality of adsorption pads configured to be adsorbed to the base layer; a connection portion connecting the moving portion to the adsorption pads; and a support for coupling the adsorption pads to the connection portion, wherein the base layer comprises: a first area at a center portion of the base layer; a second area around the first area; and adsorption points to be adsorbed to the adsorption pads in the second area.
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