Bonding head and bonding apparatus including the same
US-2026089847-A1 · Mar 26, 2026 · US
Yang Daeho is listed as an inventor on 41 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Daeho |
| Total patents | 41 |
| First publication | Apr 4, 2017 |
| Latest publication | Mar 26, 2026 |
Publications ranked by popularity score, then publication date.
US-2026089847-A1 · Mar 26, 2026 · US
US-12535689-B2 · Jan 27, 2026 · US
US-12517367-B2 · Jan 6, 2026 · US
US-12360494-B2 · Jul 15, 2025 · US
US-2025172809-A1 · May 29, 2025 · US
US-12242058-B2 · Mar 4, 2025 · US
US-12189336-B2 · Jan 7, 2025 · US
US-12158728-B2 · Dec 3, 2024 · US
US-12130589-B2 · Oct 29, 2024 · US
US-2024260483-A1 · Aug 1, 2024 · US
Latest publications not already listed above.
US-11921288-B2 · Mar 5, 2024 · US
US-2024027961-A1 · Jan 25, 2024 · US
US-11874465-B2 · Jan 16, 2024 · US
US-2024001665-A1 · Jan 4, 2024 · US
US-11852840-B2 · Dec 26, 2023 · US
US-11837310-B2 · Dec 5, 2023 · US
US-11803155-B2 · Oct 31, 2023 · US
US-11760080-B2 · Sep 19, 2023 · US
US-11740587-B2 · Aug 29, 2023 · US
US-11733651-B2 · Aug 22, 2023 · US
US-2023236544-A1 · Jul 27, 2023 · US
US-2023236545-A1 · Jul 27, 2023 · US
US-2023134565-A1 · May 4, 2023 · US
US-2023103120-A1 · Mar 30, 2023 · US
US-11613099-B2 · Mar 28, 2023 · US
US-2023056686-A1 · Feb 23, 2023 · US
US-2022357703-A1 · Nov 10, 2022 · US
US-11442277-B2 · Sep 13, 2022 · US
US-2022212459-A1 · Jul 7, 2022 · US
US-2022171209-A1 · Jun 2, 2022 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 30 |
| Samsung Display Co Ltd | 8 |
| Myongji Univ Industry And Academia Cooperation | 2 |
| Univ Industry Cooperation Group Kyung Hee Univ | 2 |
| Sk Hynix Inc | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B27/0172 | 17 |
| G02B2027/0174 | 15 |
| G03H1/0808 | 14 |
| G03H1/2294 | 14 |
| G03H2210/454 | 12 |