Peeling apparatus and manufacturing apparatus of semiconductor device

Patent metadata

Field	Value
Publication number	US-9570329-B2
Application number	US-201615204091-A
Country	US
Kind code	B2
Filing date	Jul 7, 2016
Priority date	Sep 29, 2006
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

First claim

What is claimed is:

1. A method for manufacturing a semiconductor device, comprising:
supplying a film from a supplying roller;
providing an element formation layer on a substrate with a peeling layer therebetween, the element formation layer comprising a semiconductor element;
pressing the film supplied by the supplying roller to the element formation layer between a first pressurization roller and a second pressurization roller;
bending the film by using the first pressurization roller, whereby peeling the element formation layer from the substrate;
supplying a liquid to a portion where the peeling occurs, whereby wetting the element formation layer and the peeling layer at an edge portion of the peeling;
separating the element formation layer from the substrate; and
collecting the film with a collecting roller so that a portion of the film is firstly supplied by the supplying roller, then is pressed between the first pressurization roller, and is finally collected by the collecting roller.

2. A method for manufacturing a semiconductor device, comprising:
supplying a film from a supplying roller;
providing an element formation layer on a substrate with a peeling layer therebetween, the element formation layer comprising a semiconductor element;
attaching the film supplied by the supplying roller to the element formation layer via an adhesive layer by pressing the film to the element formation layer between a first pressurization roller and a second pressurization roller;
bending the film by using the first pressurization roller, whereby peeling the element formation layer from the substrate;
supplying a liquid to a portion where the peeling occurs, whereby wetting the element formation layer and the peeling layer at an edge portion of the peeling;
separating the element formation layer from the substrate; and
collecting the film with a collecting roller so that a portion of the film is firstly supplied by the supplying roller, then is pressed between the first pressurization roller, and is finally collected by the collecting roller.

3. The method for manufacturing a semiconductor device according to claim 1 ,
wherein an adhesive layer is pressed between the film and the element formation layer.

4. The method for manufacturing a semiconductor device according to claim 2 ,
wherein an adhesive layer is pressed between the film and the element formation layer.

5. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
forming a metal film or an alloy film on the substrate; and
forming an oxide film on and in contact with the metal film or the alloy film, whereby forming the peeling layer.

6. The method for manufacturing a semiconductor device according to claim 2 , further comprising:
forming a metal film or an alloy film on the substrate; and
forming an oxide film on and in contact with the metal film or the alloy film, whereby forming the peeling layer.

7. The method for manufacturing a semiconductor device according to claim 5 ,
wherein the metal film of the alloy film comprises a metal selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, and iridium.

8. The method for manufacturing a semiconductor device according to claim 6 ,
wherein the metal film of the alloy film comprises a metal selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, and iridium.

9. The method for manufacturing a semiconductor device according to claim 5 ,
wherein the metal film of the alloy film is a tungsten film.

10. The method for manufacturing a semiconductor device according to claim 6 ,
wherein the metal film of the alloy film is a tungsten film.

11. The method for manufacturing a semiconductor device according to claim 5 ,
wherein a surface of the metal film or of the alloy film is oxidized when the oxide film is formed.

12. The method for manufacturing a semiconductor device according to claim 6 ,
wherein a surface of the metal film or of the alloy film is oxidized when the oxide film is formed.

13. The method for manufacturing a semiconductor device according to claim 1 ,
wherein peeling occurs between the element formation layer and the peeling layer.

14. The method for manufacturing a semiconductor device according to claim 2 ,
wherein peeling occurs between the element formation layer and the peeling layer.

15. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the liquid is pure water.

16. The method for manufacturing a semiconductor device according to claim 2 ,
wherein the liquid is pure water.

17. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the semiconductor device is a display module comprising a flexible circuit and a light-emitting element each connected to the semiconductor element.

18. The method for manufacturing a semiconductor device according to claim 2 ,
wherein the semiconductor device is a display module comprising a flexible circuit and a light-emitting element each connected to the semiconductor element.

19. A manufacturing apparatus comprising:
a supplying roller configured to supply a film;
a first pressurization roller and a second pressurization roller configured to press the film to an element formation layer, the element formation layer being attached to a substrate via a peeling layer;
a collecting roller configured to collect the film after it has been pressed between the first pressurization roller and the second pressurization roller; and
a liquid supplying nozzle configured to supply a liquid,
wherein the manufacturing apparatus is configured to attach the film to the element formation layer and to peel the element formation layer from the substrate by bending the film and the element formation layer by using the first pressurization roller, after they have been attached to each other, and
wherein the manufacturing apparatus is configured to supply the liquid to a portion where the peeling occurs, whereby wetting the element formation layer and the peeling layer at an edge portion of the peeling.

20. The manufacturing apparatus according to claim 19 ,
wherein the film and the element formation layer are attached to each other by being pressed to each other by the first pressurization roller and the second pressurization roller.

Assignees

• Semiconductor Energy Lab

Inventors

• Eguchi Shingo
• Monma Yohei
• Tani Atsuhiro
• Hirosue Misako
• Hashimoto Kenichi
• Hosaka Yasuharu

Classifications

• H10P72/7446

  using a peeling wheel · CPC title

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title