Molybdenum containing targets

Patent metadata

Field	Value
Publication number	US-11753702-B2
Application number	US-202017038325-A
Country	US
Kind code	B2
Filing date	Sep 30, 2020
Priority date	Jun 30, 2010
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of niobium or vanadium, and a third metal element selected from the group consisting of titanium, chromium, niobium, vanadium, and tantalum, wherein the third metal element is different from the second metal element, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in the second metal element, and a phase that is rich in the third metal element.

First claim

What is claimed is:

1. A sputter target that is sputterable to form a film comprising an alloy, the sputter target comprising molybdenum, titanium, vanadium, chromium, tantalum, and niobium,
wherein (i) a total concentration of molybdenum, titanium, vanadium, chromium, tantalum, and niobium in the sputter target is 99 atomic percent or more, based on the total number of atoms in the sputter target, and (ii) the sputter target contains at least 50 atomic percent molybdenum.

2. The sputter target of claim 1 , wherein the total concentration of molybdenum, titanium, vanadium, chromium, tantalum, and niobium in the sputter target is 99.5 atomic percent or more, based on the total number of atoms in the sputter target.

3. The sputter target of claim 1 , wherein the sputter target contains at least 65 atomic percent molybdenum.

4. The sputter target of claim 1 , wherein the sputter target contains no more than 95 atomic percent molybdenum.

5. The sputter target of claim 1 , wherein the sputter target contains no more than 85 atomic percent molybdenum.

6. The sputter target of claim 1 , wherein the sputter target contains no more than 81 atomic percent molybdenum.

7. The sputter target of claim 1 , wherein the sputter target comprises a plurality of phases.

8. The sputter target of claim 7 , wherein the plurality of phases comprises one or more first phases, each first phase (i) comprising at least 50 atomic percent molybdenum and (ii) being a continuous phase.

9. The sputter target of claim 8 , wherein the plurality of phases comprises one or more discrete phases dispersed within at least one of the first phases.

10. A method for manufacturing a touch screen device, the method comprising:
depositing a molybdenum alloy layer over a substrate; and
depositing a conductive layer over the molybdenum alloy layer,
wherein the molybdenum alloy layer is deposited by sputtering the sputter target of claim 1 .

11. The method of claim 10 , further comprising etching the molybdenum alloy layer before depositing the conductive layer.

12. The method of claim 10 , wherein the conductive layer comprises at least one of Cu, Al, Ag, or Au.

13. The method of claim 10 , further comprising, before depositing the molybdenum alloy layer, at least one of (i) removing an oxide from the sputter target or (ii) removing an oxide from the substrate.

14. The method of claim 10 , wherein the substrate comprises glass.

15. The method of claim 10 , wherein the substrate comprises silicon.

16. The method of claim 10 , wherein a thickness of the molybdenum alloy layer is less than 200 nm.

17. The sputter target of claim 1 , wherein the sputter target consists of molybdenum, titanium, vanadium, chromium, tantalum, and niobium.

Assignees

• Starck H C Inc
• H C Starck Solutions Euclid Llc

Inventors

• Rozak Gary Alan
• Gaydos Mark E
• Hogan Patrick Alan
• Sun Shuwei

Classifications

• C22C27/04 Primary

  Alloys based on tungsten or molybdenum · CPC title

• C23C14/185 Primary

  by cathodic sputtering · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/041

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• C23C14/3407

  Cathode assembly for sputtering apparatus, e.g. Target · CPC title