Cutting apparatus and cutting method

Patent metadata

Field	Value
Publication number	US-11745374-B2
Application number	US-202117144318-A
Country	US
Kind code	B2
Filing date	Jan 8, 2021
Priority date	Jan 28, 2020
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

A cutting apparatus includes a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds a workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section. The removing unit includes a contact member positioned at a contact position for making contact with the transparent section and a retracted position, and an X-axis moving unit that relatively moves on the transparent section the contact member making contact with the transparent section.

First claim

What is claimed is:

1. A cutting apparatus comprising:
a holding table that has, at at least a part of a holding surface, a transparent section including a transparent member and that holds a workpiece;
a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade;
an imaging camera, which is disposed below the transparent section, that images the workpiece through the transparent section; and
a removing unit that removes a liquid adhered to the transparent section.

2. The cutting apparatus according to claim 1 , wherein the removing unit includes:
a contact member that is positioned at a contact position for making contact with the transparent section and a retracted position, and
a moving mechanism that relatively moves on the transparent section the contact member making contact with the transparent section.

3. The cutting apparatus according to claim 1 , wherein the removing unit includes:
a jetting section that jets air toward the transparent section, and
a moving mechanism that moves the jetting section on the transparent section.

4. A cutting method for processing a workpiece by a cutting apparatus, the cutting apparatus including a holding table that has, at at least a part of a holding surface, a transparent section including a transparent member and that holds the workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera, which is disposed below the transparent section, that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section, the cutting method comprising:
a removing step of removing the liquid on the transparent section by the removing unit;
a holding step of holding the workpiece by the holding table, after the removing step is carried out;
an imaging step of imaging the workpiece by the imaging camera through the transparent section, after the holding step is carried out; and
a cutting step of cutting the workpiece held by the holding table by the cutting blade.

5. A cutting apparatus comprising:
a holding table that has, at at least a part of a holding surface, a transparent section including a transparent member and that holds a workpiece;
a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade;
an imaging camera that images the workpiece through the transparent section; and
a removing unit that removes a liquid adhered to the transparent section, wherein the removing unit includes:
a contact member that is positioned at a contact position for making contact with the transparent section and a retracted position, and
a moving mechanism that relatively moves on the transparent section the contact member making contact with the transparent section.

6. The cutting apparatus according to claim 1 , wherein at least a portion of the removing unit moves relative to the transparent section.

7. The cutting apparatus according to claim 1 , wherein the transparent member is one of: quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, and magnesium fluoride.

8. The cutting apparatus according to claim 5 , wherein the transparent member is one of: quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, and magnesium fluoride.

9. The cutting apparatus according to claim 1 , wherein the holding surface includes a plurality of suction grooves in the shape of circles different in diameter and disposed concentrically at an outer edge portion of the holding surface.

10. The cutting apparatus according to claim 5 , wherein the holding surface includes a plurality of suction grooves in the shape of circles different in diameter and disposed concentrically at an outer edge portion of the holding surface.

11. The cutting apparatus according to claim 2 , wherein the removing unit further includes:
a lifting mechanism which lifts the contact member upward and downward in a Z-axis direction.

12. The cutting apparatus according to claim 3 , wherein the jetting section includes a plurality of air jetting ports arranged at intervals in the longitudinal direction of the jetting section.

13. The cutting apparatus according to claim 1 , wherein the holding table includes a plurality of frame fixing sections which include:
a frame support section; and
a vacuum pad that holds an annular frame of the workpiece under suction.

14. The cutting apparatus according to claim 5 , wherein the holding table includes a plurality of frame fixing sections which include:
a frame support section; and
a vacuum pad that holds an annular frame of the workpiece under suction.

Assignees

• Disco Corp

Inventors

• Hanajima Satoshi
• Nakama Jun

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/53

  using optical controlling means · CPC title