Method for joining metal parts

Patent metadata

Field	Value
Publication number	US-11738414-B2
Application number	US-202017606566-A
Country	US
Kind code	B2
Filing date	May 8, 2020
Priority date	May 29, 2019
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1100° C., includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1100° C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The boron at least partly originates from a boron compound selected from any of the following compounds: boric acid, borax, titanium diboride and boron nitride. The melting depressant composition and related products are also described.

First claim

The invention claimed is:

1. A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1100° C., the method comprising:
applying a melting depressant composition at least on a surface of the first metal part, the melting depressant composition comprising:
a melting depressant component comprising at least 25 wt % boron and silicon in total for decreasing a melting temperature of the first metal part; and
optionally, a binder component for facilitating the applying of the melting depressant composition on the surface;
bringing the second metal part into contact with the melting depressant composition at a contact point on said surface;
heating the first and second metal parts to a temperature above 1100° C., said surface of the first metal part thereby melting such that a surface layer of the first metal part melts and, together with the melting depressant component, forms a molten metal layer that is in contact with the second metal part at the contact point; and
allowing the molten metal layer to solidify, such that a joint is obtained at the contact point,
wherein a source of the boron comprises a boron compound selected from any of the following compounds: titanium diboride, boron nitride and/or combinations thereof.

2. The method according to claim 1 , wherein the boron compound provides 15-100 wt %, or 50 to 100 wt % of a total weight of the boron.

3. The method according to claim 1 , wherein a source of the silicon comprises any of elemental silicon and silicon of a silicon compound selected from at least any of the following compounds: silicon carbide, silicon boride and ferrosilicon.

4. The method according to claim 1 , wherein the melting depressant component comprises at least 40 wt % boron and silicon.

5. The method according to claim 1 , wherein the melting depressant component comprises at least 85 wt % boron and silicon.

6. The method according to claim 1 , wherein boron constitutes at least 10 wt % of the boron and silicon content of the melting depressant compound.

7. The method according to claim 1 , wherein silicon constitutes at least 55 wt % of the boron and silicon content of the melting depressant compound.

8. The method according to claim 1 , wherein the melting depressant component comprises less than 50 wt % metallic elements.

9. The method according to claim 1 , wherein the melting depressant component comprises less than 10 wt % metallic elements.

10. The method according to claim 1 , wherein the first metal part comprises a thickness of 0.1-1.0, or 0.6 to 1.0, or 0.3 to 0.6 mm and the applying of the melting depressant composition comprises applying an average of 0.02-0.12 mg boron and silicon per mm 2 on the surface of the first metal part.

11. The method according to claim 1 , wherein the surface has an area that is larger than an area defined by the contact point on said surface, such that metal in the melted metal layer flows to the contact point when allowing the joint to form.

12. The method according to claim 1 , wherein the first metal part comprises >50 wt % Fe, <13 wt % Cr, <1 wt % Mo, <1 wt % Ni and <3 wt % Mn.

13. The method according to claim 1 , wherein the first metal part comprises >10 wt % Cr and >60 wt % Ni.

14. A product comprising a first metal part that is joined with a second metal part according to the method of claim 1 .

15. A melting depressant composition for joining a first metal part with a second metal part according to the method of claim 1 , the melting depressant composition comprising:
i) a melting depressant component that comprises at least 25 wt % boron and silicon for decreasing a melting temperature; and
ii), optionally, a binder component for facilitating applying of the melting depressant composition on the first metal part,
wherein a source of the boron comprises a boron compound selected from any of the following compounds: titanium diboride and boron nitride.

16. The method according to claim 2 , wherein a source of the silicon comprises any of elemental silicon and silicon of a silicon compound selected from at least any of the following compounds: silicon carbide, silicon boride and ferrosilicon.

17. The method according to claim 2 , wherein the melting depressant component comprises at least 40 wt % boron and silicon.

18. The method according to claim 3 , wherein the melting depressant component comprises at least 40 wt % boron and silicon.

19. The method according to claim 2 , wherein the melting depressant component comprises at least 85 wt % boron and silicon.

20. The method according to claim 3 , wherein the melting depressant component comprises at least 85 wt % boron and silicon.

Assignees

• Alfa Laval Corp Ab

Inventors

• Sjödin Per
• Walter Kristian
• Knutsson Axel

Classifications

• B23K35/362 Primary

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title

• B23K35/24

  Selection of soldering or welding materials proper (B23K35/34 takes precedence) · CPC title

• B23K1/0008

  specially adapted for particular articles or work · CPC title

• B23K35/3086

  containing Ni or Mn · CPC title

• B23K1/203

  Fluxing, i.e. applying flux onto surfaces · CPC title