Solder alloy, solder composition, solder paste, and electronic circuit board
US-9931716-B2 · Apr 3, 2018 · US
Lead-free solder composition
US11738412B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11738412-B2 |
| Application number | US-202217835153-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 8, 2022 |
| Priority date | Sep 21, 2020 |
| Publication date | Aug 29, 2023 |
| Grant date | Aug 29, 2023 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.
First claim
Opening claim text (preview).
We claim: 1. An electrical assembly, comprising: an electrical connector having a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector; and a layer of a solder alloy consisting essentially of: about 15% to 28% indium by weight; about 5% to 20% zinc by weight; about 1% to 6% silver by weight; and a remaining weight of the solder alloy being tin. 2. The electrical assembly according to claim 1 , wherein the solder alloy consists essentially of: 21% to 27% indium by weight; 8% to 10% zinc by weight; 2% to 4% silver by weight; and a remaining weight of the solder alloy being tin. 3. The electrical assembly according to claim 1 , wherein the solder alloy consists essentially of: about 24% indium by weight; about 9% zinc by weight; about 3% silver by weight; and a remaining weight of the solder alloy being tin. 4. The electrical assembly according to claim 1 , wherein the second layer is soldered to a silver-based connection pad. 5. The electrical assembly according to claim 4 , wherein the silver-based connection pad is disposed on a glass surface. 6. An electrical assembly, comprising: an electrical connector having a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector and wherein the electrical connector is soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of: 17% to 28% indium by weight; 12% to 20% zinc by weight; 1% to 6% silver by weight; and a remaining weight of the solder alloy being tin. 7. The electrical assembly according to claim 6 , wherein the solder alloy includes 23% to 26% indium by weight. 8. The electrical assembly according to claim 6 , wherein the solder alloy includes 24% to 26% indium by weight. 9. The electrical assembly according to claim 6 , wherein the solder alloy includes 25% to 26% indium by weight. 10. The electrical assembly according to claim 6 , wherein the solder alloy includes 5.5% to 6% silver by weight. 11. The electrical assembly according to claim 6 , wherein the solder alloy includes 5.75% to 6% silver by weight. 12. An electrical assembly, comprising: an electrical connector having a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector and wherein the electrical connector is soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of: 17% to 28% indium by weight; 12% to 20% zinc by weight; 1% to 6% silver by weight; 1% to 3% copper by weight; and a remaining weight of the solder alloy being tin. 13. The electrical assembly according to claim 12 , wherein the solder alloy includes 23% to 26% indium by weight. 14. The electrical assembly according to claim 12 , wherein the solder alloy includes 24% to 26% indium by weight. 15. The electrical assembly according to claim 12 , wherein the solder alloy includes 25% to 26% indium by weight. 16. The electrical assembly according to claim 12 , wherein the solder alloy includes 5.5% to 6% silver by weight. 17. The electrical assembly according to claim 12 , wherein the solder alloy includes 5.75% to 6% silver by weight.
Assignees
Inventors
Classifications
- B23K35/262Primary
Sn as the principal constituent · CPC title
Alloys based on tin · CPC title
containing tin or lead · CPC title
containing zinc · CPC title
Iron or ferrous alloys · CPC title
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Frequently asked questions
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- What does patent US11738412B2 cover?
- An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.
- Who is the assignee on this patent?
- Aptiv Tech Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 29 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).