Memory module cooler with vapor chamber device connected to heat pipes

Patent metadata

Field	Value
Publication number	US-10462932-B2
Application number	US-201715800695-A
Country	US
Kind code	B2
Filing date	Nov 1, 2017
Priority date	Nov 1, 2017
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

First claim

What is claimed is:

1. A memory module cooler comprising:
a vapor chamber device with walls that bound a vapor chamber;
a number of heat pipes that include vapor channels, the heat pipes being connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber;
fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber, the fins and the second wall being part of the same continuous body, the fins being outside of the vapor chamber; and
a cold plate cover sealed to the second wall of the vapor chamber device around the fins, wherein the cold plate cover and the second wall of the vapor chamber device bound a liquid coolant chamber.

2. The memory module cooler of claim 1 ,
wherein the liquid coolant chamber is liquid tight except for openings of hose connectors.

3. The memory module cooler of claim 1 , further comprising:
a working fluid within the vapor chamber and the vapor channels;
a wick structure in the vapor chamber; and
a wick structure in each of the vapor channels.

4. The memory module cooler of claim 1 ,
wherein the heat pipes are arranged such that they are capable of being interleaved with memory modules installed in a computer when the memory module cooler is installed in the computer.

5. A computer comprising:
a number of memory modules installed in a printed circuit board;
a vapor chamber device with walls that bound a vapor chamber;
a number of heat pipes that include vapor channels, the heat pipes being connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber, each of the heat pipes being thermally coupled with at least one of the memory modules; and
fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber, the fins and the second wall being part of the same continuous body, the fins being outside the vapor chamber; and
a cooling system that is arranged to flow a heat removal medium over the fins.

6. The computer of claim 5 , further comprising:
a cold plate cover sealed to the second wall of the vapor chamber device around the fins, wherein the cold plate cover and the second wall of the vapor chamber device bound a liquid coolant chamber,
wherein the heat removal medium is liquid coolant and the liquid coolant chamber is connected into a liquid coolant flow of the cooling system.

7. The computer of claim 5 , further comprising
a fan arranged to blow air as the heat removal medium over the fins.

8. The computer of claim 5 , further comprising:
a working fluid within the vapor chamber and the vapor channels;
a wick structure in the vapor chamber; and
a wick structure in each of the vapor channels.

9. The computer of claim 5 ,
wherein the heat pipes are interleaved with the memory modules.

10. The computer of claim 9 ,
wherein each one of the heat pipes that is between two adjacent ones of the memory modules is thermally coupled with both of the memory modules it is between.

11. The computer of claim 10 ,
wherein the heat pipes are thermally coupled with the memory modules via at least one thermal interface material.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Gaskill Travis J

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title